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Stitched multipatterning for routing metal, even within era of EUV, for 2nm and beyond

Fred Chen

Moderator
As the semiconductor process further scales down to 2nm and beyond, the multi-patterning technology has emerged as the clear choice of the routing metal layers even within the era of extreme ultraviolet (EUV) lithography.

The stitching technique within multi-patterning can divide a node into multiple nodes, each of which can be assigned to different colors to prevent color conflicts.

 
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