NVIDIA and TSMC have developed a silicon photonics-based chip prototype, according to a report in the Taiwanese press. TSMC is the world's leading contract chip manufacturer, and with Intel's troubles, it has also established itself as the most advanced chip manufacturer on the planet. Silicon photonics is an emerging chip manufacturing technology that blends photonic circuits with traditional circuits to overcome physical limitations with semiconductor fabrication. According to the report, the prototype was developed late last year, with NVIDIA and TSMC also working on optical packaging technologies to improve AI chip performance.
These dimensions are collectively dubbed the 2-nanometer process technology node. However, the increasing complexity of reducing these distances means that chip manufacturers such as TSMC find it difficult to significantly scale up the number of transistors on a single chip. To overcome these limitations, one technology that has generated interest in the industry is silicon photonics.
Silicon photonics uses photonic transistors, or integrated circuits, to replace electrons with photons, or light particles, for communication within a chip. These transistors allow greater bandwidth and frequency to increase data speed and volume for processing.
Traditional and silicon photonic transistors on a CMOS wafer. Image: Grenouillet, L. & Philippe, P. & Harduin, J. & Olivier, Neavera & Grosse, P. & Liu, L. & Spuesens, Thijs & Regreny, Philippe & MANDORLO, Fabien & Rojo-Romeo, Pedro. (2010). Towards Optical Networks-on-Chip Using CMOS Compatible III-V/SOI Technology. Solid State Devices and Materials (SSDM) Conference, Tokyo. 10.7567/SSDM.2010.D-6-2.
Since these transistors are able to improve processing speeds without requiring significantly advanced manufacturing techniques, they have generated industry interest in today's era of diminishing returns from advanced chip manufacturing technologies.
A report from the Taiwanese UDN suggests that AI chip giant NVIDIA is also among those with piquing interest. It claims that NVIDIA and TSMC developed the first silicon photonic chip prototype at the end of last year. Along with the prototype, the report claims that NVIDIA and TSMC are also working on optoelectronic integration technologies and advanced packaging.
Optoelectronic integration follows in tune with silicon photonics as it integrates components that manage light, such as lasers and photodiodes, with those that deal with electrons, such as transistors, on the same wafer.
TSMC is NVIDIA's primary manufacturing partner for its latest chips, since the Taiwanese fab's consistent output and high yields have made it the preferred partner of the world's leading technology companies. NVIDIA's AI chips are the industry leader in performance, but constraints such as packaging capacity and high prices have limited their supply.
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NVIDIA & TSMC Are Working On Advanced Packaging Technologies, Says Report
TSMC's latest chip manufacturing technology, the 2-nanometer node, is believed to have a minimum gate and metal pitches of 45 and 20 nanometers, respectively. In semiconductor fabrication, a gate pitch measures the distance between two gates on a chip, while a metal pitch measures the distance between two metal interconnects. A gate controls the flow of electrons on a transistor, while an interconnect ensures inter-transistor communication on a chip.These dimensions are collectively dubbed the 2-nanometer process technology node. However, the increasing complexity of reducing these distances means that chip manufacturers such as TSMC find it difficult to significantly scale up the number of transistors on a single chip. To overcome these limitations, one technology that has generated interest in the industry is silicon photonics.
Silicon photonics uses photonic transistors, or integrated circuits, to replace electrons with photons, or light particles, for communication within a chip. These transistors allow greater bandwidth and frequency to increase data speed and volume for processing.
Traditional and silicon photonic transistors on a CMOS wafer. Image: Grenouillet, L. & Philippe, P. & Harduin, J. & Olivier, Neavera & Grosse, P. & Liu, L. & Spuesens, Thijs & Regreny, Philippe & MANDORLO, Fabien & Rojo-Romeo, Pedro. (2010). Towards Optical Networks-on-Chip Using CMOS Compatible III-V/SOI Technology. Solid State Devices and Materials (SSDM) Conference, Tokyo. 10.7567/SSDM.2010.D-6-2.
Since these transistors are able to improve processing speeds without requiring significantly advanced manufacturing techniques, they have generated industry interest in today's era of diminishing returns from advanced chip manufacturing technologies.
A report from the Taiwanese UDN suggests that AI chip giant NVIDIA is also among those with piquing interest. It claims that NVIDIA and TSMC developed the first silicon photonic chip prototype at the end of last year. Along with the prototype, the report claims that NVIDIA and TSMC are also working on optoelectronic integration technologies and advanced packaging.
Optoelectronic integration follows in tune with silicon photonics as it integrates components that manage light, such as lasers and photodiodes, with those that deal with electrons, such as transistors, on the same wafer.
TSMC is NVIDIA's primary manufacturing partner for its latest chips, since the Taiwanese fab's consistent output and high yields have made it the preferred partner of the world's leading technology companies. NVIDIA's AI chips are the industry leader in performance, but constraints such as packaging capacity and high prices have limited their supply.
NVIDIA, TSMC Develop Advanced Silicon Photonic Chip Prototype, Says Report
NVIDIA and TSMC have developed a silicon photonic based chip prototype claims a fresh report from Taiwan. Take a look!