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NVIDIA's CEO Jensen Huang has reaffirmed the company's commitment to TSMC, claiming that Team Green has no other "suitable" alternatives to the Taiwan giant.
NVIDIA's CEO Says TSMC Is The Leader In CoWoS, The Advanced Packaging Technology Which Defied Moore's Law
NVIDIA has been a key partner for TSMC for several years now, but the company has specifically deepened its cooperation after the initial AI hype. The partnership has evolved to a point where Team Green's CEO now says there's no alternative to the Taiwan giant, especially in the CoWoS department. Speaking at the GTC Taipei Global Press Conference, NVIDIA's Jensen Huang revealed that the company's semiconductor supply chain will rely entirely on TSMC in the near future, indicating that alternatives from Samsung Foundry or Intel haven't worked out for them.
When Jensen was asked whether NVIDIA would consider a partner other than TSMC for semiconductors, especially in the US, here's what he had to say:
This is a very advanced packaging technology. I'm sorry we don't have any other choice at the moment," and pointed out that TSMC is still the only partner.
One of the key reasons why NVIDIA has managed to bring such high performance to the table is that the company has managed to defy Moore's Law by integrating technologies such as CoWoS, since the packaging technology allowed Team Green to stack multiple chips together, combining performance and bringing it to levels which couldn't have been done by node shrinking. Jensen claims that there's no alternative to CoWoS, and based on industry reports, we know that TSMC holds the reins in the advanced packaging segment.
Team Green was reportedly collaborating with Samsung and Intel for advanced packaging, but it seems no deal has been formulated yet. Similarly, on the chip frontier, NVIDIA is a primary partner of TSMC and has even crossed Apple when it comes to the valuation of orders placed with the Taiwan giant. Apart from this, NVIDIA has played a massive roel in TSMC's US expansion as well, being the major customer for the company's regional operations.
So it is safe to say that an NVIDIA-TSMC partnership will go a long way, as stated by Jensen at the Computex keynote, and with the Taiwan giant expanding into the US, Team Green will be free from geopolitical uncertainties.
wccftech.com
NVIDIA's CEO Says TSMC Is The Leader In CoWoS, The Advanced Packaging Technology Which Defied Moore's Law
NVIDIA has been a key partner for TSMC for several years now, but the company has specifically deepened its cooperation after the initial AI hype. The partnership has evolved to a point where Team Green's CEO now says there's no alternative to the Taiwan giant, especially in the CoWoS department. Speaking at the GTC Taipei Global Press Conference, NVIDIA's Jensen Huang revealed that the company's semiconductor supply chain will rely entirely on TSMC in the near future, indicating that alternatives from Samsung Foundry or Intel haven't worked out for them.
When Jensen was asked whether NVIDIA would consider a partner other than TSMC for semiconductors, especially in the US, here's what he had to say:
This is a very advanced packaging technology. I'm sorry we don't have any other choice at the moment," and pointed out that TSMC is still the only partner.
One of the key reasons why NVIDIA has managed to bring such high performance to the table is that the company has managed to defy Moore's Law by integrating technologies such as CoWoS, since the packaging technology allowed Team Green to stack multiple chips together, combining performance and bringing it to levels which couldn't have been done by node shrinking. Jensen claims that there's no alternative to CoWoS, and based on industry reports, we know that TSMC holds the reins in the advanced packaging segment.
Team Green was reportedly collaborating with Samsung and Intel for advanced packaging, but it seems no deal has been formulated yet. Similarly, on the chip frontier, NVIDIA is a primary partner of TSMC and has even crossed Apple when it comes to the valuation of orders placed with the Taiwan giant. Apart from this, NVIDIA has played a massive roel in TSMC's US expansion as well, being the major customer for the company's regional operations.
So it is safe to say that an NVIDIA-TSMC partnership will go a long way, as stated by Jensen at the Computex keynote, and with the Taiwan giant expanding into the US, Team Green will be free from geopolitical uncertainties.
NVIDIA's CEO Claims That They Have No Option Other Than TSMC For Chips, Rules Out Partnership With Intel & Samsung Foundry In The US
NVIDIA's CEO Jensen Huang has reaffirmed the company's commitment to TSMC, claiming that Team Green has no other "suitable" alternatives.
wccftech.com