I wonder if the packaging customers will switch back to TSMC when they have more capacity? Even more interesting, will packaging give Intel Foundry an opening to wafer business? I wonder who the external customer is? I'm still looking... Progress!
Intel 18A Update Graphic
- Thread starter Daniel Nenni
- Start date
MKWVentures
Moderator
I would keep track of the external packaging and wafer revenue. It has dropped significantly over the past few quarters.
Is 1 year from PDK1.0 to tapeout typical? Or are they waiting for Intel to qualify an internal product first?
Is 1 year from PDK1.0 to tapeout typical? Or are they waiting for Intel to qualify an internal product first?
Depends
It depends on the PDK and chip size. TSMC customers are much quicker but the PDKs are rock solid. It also depends on if it is a full chip or chiplet. Either way Intel 18A missed the whale migration.
It depends on the PDK and chip size. TSMC customers are much quicker but the PDKs are rock solid. It also depends on if it is a full chip or chiplet. Either way Intel 18A missed the whale migration.
Q3'24 Synopsys earnings call, CEO Sassine Ghazi's commentary,
"...Physical verification was also a point of strength in the quarter. We continued to win new designs on ICV with 20 tapeouts in Q3. Four of these tapeouts were on TSMC N3 and one on IFS 18A, where engagements are increasing rapidly..."
Any thoughts on this commentary, is this just an Intel Product then?
"...Physical verification was also a point of strength in the quarter. We continued to win new designs on ICV with 20 tapeouts in Q3. Four of these tapeouts were on TSMC N3 and one on IFS 18A, where engagements are increasing rapidly..."
Any thoughts on this commentary, is this just an Intel Product then?
MKWVentures
Moderator
Intel said first external tapeout was in 1H2025. So then this must be internal, correct?