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GigaDevice proves flash makers don't need fabs

Fred Chen

Moderator

BEIJING, April 14, 2023 (GLOBE NEWSWIRE) -- GigaDevice (SSE: 603986), a semiconductor industry leader in flash memory, 32-bit microcontrollers (MCUs), sensors, and analog technology, proudly announces the milestone of shipping 100 million units of its leading automotive-grade (AEC-Q100) GD25/55 SPI NOR and GD5F SPI NAND flash series.

Though fabless, GigaDevice is supplied with 38nm and 24nm NAND Flash by SMIC and 65nm and smaller NOR Flash by XMC and HuaHong.
 
I didn't know that SMIC made NAND flash. Kind of reminiscent of the old IDMs from like the 70s who would every type of transistor (Bipolar, EPROM, ROM, SRAM, DRAM, flash, CMOS, NMOS, etc) under the sun. Back on topic is this no different than what we already see? WD doesn't own any fabs but gets their NAND from Toshiba/Kioxia. Segate is another example of just buying or designing the controller and buying flash off the market from four of the big six.
 
I didn't know that SMIC made NAND flash. Kind of reminiscent of the old IDMs from like the 70s who would every type of transistor (Bipolar, EPROM, ROM, SRAM, DRAM, flash, CMOS, NMOS, etc) under the sun. Back on topic is this no different than what we already see? WD doesn't own any fabs but gets their NAND from Toshiba/Kioxia. Segate is another example of just buying or designing the controller and buying flash off the market from four of the big six.
WD actually jointly owns the fab with Kioxia, continuing the SanDisk strategy. I haven't seen WD sell flash directly like Kioxia does, though. Seagate is also just drives, right?

GigaDevice actually sells discrete flash as if they made it themselves, but it's from a Chinese foundry.
 
Well,there is lots of chips that is usually IDM,but in China they are fabless. Such as CIS,Sony/Samsung/Hynix are IDM,Chinese players Omnivision/GalaxyCore/SmartSens are fabless.
 
GD is a major MCU player now thanks to STM shortages, and them choosing deliberately making drop-in replacement MCUs for STM line.

One of their innovation is co-packaging of flash, and MCUs. A rather low tech wirebond, but it works, and is hugely popular. Close to no downsides in comparison to monolithic dies.

It capitalised on huge premiums bigger MCU players put on MCUs with larger on-die SRAM/eFlash.
 
GD is a major MCU player now thanks to STM shortages, and them choosing deliberately making drop-in replacement MCUs for STM line.

One of their innovation is co-packaging of flash, and MCUs. A rather low tech wirebond, but it works, and is hugely popular. Close to no downsides in comparison to monolithic dies.

It capitalised on huge premiums bigger MCU players put on MCUs with larger on-die SRAM/eFlash.
Packaging gives unexpected leverages in unexpected ways.
 
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