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Eurocontrol (EUO.v/EUCTF) - XwinSys hybrid EDXRF, 2-D, & 3-D metrology/insp systems
Looking for qualified opinions on Eurocontrol's (EUO.v/EUCTF) subsidiary company, XwinSys Technology Development Ltd., and their semiconductor inspection and metrology systems that combine EDXRF analysis with 2D and 3D microscopy to provide a patented method for detecting voids in solder bumps, UBM/RDL, as well as other applications for 3D IC inspections, and more conventional inspection and metrology applications for defects in wafers and thin films.
Company Background
To provide a brief background, Eurocontrol's other subsidiary Xenemetrix designs and builds EDXRF analytical instruments and was spun-off from Jordan Valley Semiconductors in 2008. In 2012 Eurocontrol formed XwinSys in partnership with Brossh Inspection Systems, who provides the 2D and 3D imaging applications.
Useful links
Company website:
Home - XwinSys
Bump Inspection - Composition & Height:
Bump Inspection - Composition & Height - XwinSys
UBM/RDL Thickness and Composition Monitoring:
UBM/RDL: Thickness and Composition Monitoring - XwinSys
Ultra Thin Film measurements down to a single Angstrom:
Ultra-Thin Films Measurement - XwinSys
USPatent No. 9,335,283: Method and a system for recognizing voids in a bumphttp://patft.uspto.gov/netacgi/nph-...1=AND&d=PTXT&s1=xwinsys&OS=xwinsys&RS=xwinsys
Disclosure: I hold a long term position in the stock of Eurocontrol Technics Group.
Looking for qualified opinions on Eurocontrol's (EUO.v/EUCTF) subsidiary company, XwinSys Technology Development Ltd., and their semiconductor inspection and metrology systems that combine EDXRF analysis with 2D and 3D microscopy to provide a patented method for detecting voids in solder bumps, UBM/RDL, as well as other applications for 3D IC inspections, and more conventional inspection and metrology applications for defects in wafers and thin films.
Company Background
To provide a brief background, Eurocontrol's other subsidiary Xenemetrix designs and builds EDXRF analytical instruments and was spun-off from Jordan Valley Semiconductors in 2008. In 2012 Eurocontrol formed XwinSys in partnership with Brossh Inspection Systems, who provides the 2D and 3D imaging applications.
Useful links
Company website:
Home - XwinSys
Bump Inspection - Composition & Height:
Bump Inspection - Composition & Height - XwinSys
UBM/RDL Thickness and Composition Monitoring:
UBM/RDL: Thickness and Composition Monitoring - XwinSys
Ultra Thin Film measurements down to a single Angstrom:
Ultra-Thin Films Measurement - XwinSys
USPatent No. 9,335,283: Method and a system for recognizing voids in a bumphttp://patft.uspto.gov/netacgi/nph-...1=AND&d=PTXT&s1=xwinsys&OS=xwinsys&RS=xwinsys
Disclosure: I hold a long term position in the stock of Eurocontrol Technics Group.
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