Daniel Payne
Moderator
I'm encouraged to see a semiconductor company file for an IPO, it's been awhile since we've seen much IPO action.
Press Release
View attachment 13357
eASIC Nextreme-3™ is eASIC’s fourth generation eASIC Platform manufactured on a 28 nm CMOS process. The eASIC Nextreme-3 family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow and rapid delivery of prototype devices. eASIC Nextreme-3 Platforms come with an enhanced architecture that offers twice the performance and half of the power consumption of eASIC Nextreme-2™ (eASIC’s 45 nm Platforms).
Key Features
Press Release
View attachment 13357
eASIC Nextreme-3™ is eASIC’s fourth generation eASIC Platform manufactured on a 28 nm CMOS process. The eASIC Nextreme-3 family provides ASIC-like performance, power and low unit-cost combined with FPGA-like design flow and rapid delivery of prototype devices. eASIC Nextreme-3 Platforms come with an enhanced architecture that offers twice the performance and half of the power consumption of eASIC Nextreme-2™ (eASIC’s 45 nm Platforms).
Key Features
- TSMC 28nm HP process with core operating voltage of 0.85 V
- Up to 80% lower power than FPGAs
- Up to twice the performance of 28 nm FPGAs
- Instant on – No SRAM cells for configuration avoiding SEU CRAM
- Up to 1.8M eCELLS (18M equivalent ASIC gates)
- Up to 56 Mbits of embedded memory blocks (bRAMS) with Built-In-Self Repair
- 800 MHz fine grained 9K bits memory blocks
- Embedded one bit fast adders for high-speed arithmetic and DSP functions
- Multi-gigabit I/O with speeds up to 12.5 Gbps
- New enhanced clocking structure with 36 global clock trees
- GreenPowerVia disables power to unused logic
- Support for 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.35 V and 1.2 V IO standards
- eFUSE for traceability and storing special keys
- Temperature sensing diode
- FPGA like design tools and flow