ASML (NASDAQ:ASML) to deliver $380M chipmaking machine to TSMC and Samsung this year

[Daniel Nenni]

ASML Holding (NASDAQ:ASML), the leading manufacturer of chipmaking technology, is set to deliver its latest high-NA extreme ultraviolet (EUV) machines to Taiwan Semiconductor Manufacturing Co. (NYSE:TSM) and Samsung Electronics Co. by the end of this year.

This announcement follows the company's recent shipment to Intel Corp., which received its first high-NA EUV machine at its Oregon factory in late December.

ASML's Chief Financial Officer, Roger Dassen, confirmed during a call with analysts that all three major customers—TSMC, Intel, and Samsung—will have the new machines by year's end.

While specific delivery dates for TSMC, ASML's largest EUV customer, remain undisclosed, a representative from TSMC emphasized the company's close collaboration with its suppliers.

The new high-NA EUV machine can create semiconductor lines as thin as 8 nanometers, significantly smaller than the previous generation, and is poised to enhance the production of chips for artificial intelligence and advanced consumer electronics.

Each machine costs €350 million ($380 million) and weighs as much as two Airbus A320s.

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[Fred Chen]

If true, not much advantage for Intel.

 

[Daniel Nenni]

Considering HNA-EUV is 5 years out? Not much advantage for anyone, yet. ASML also set up a HNA-EUV sandbox with imec for all vendors to play in:

ASML and imec open high-NA EUV lithography lab

Facility at ASML's Veldhoven headquarters offers access to the first prototype high-NA EUV scanner.

optics.org

 

[nghanayem]

If true, not much advantage for Intel.

An extra 2 quarters of data turns vs TSMC is a pretty big deal. This is especially valuable because intel has fewer possible data turns to get high-NA to the maturity level needed to replace some low-NA SALELE layers for 14A than TSMC has for A14 due to intel trying to get 14A out first. Either way as I have said for well over a year now, the real tell is who gets the next 10 units once everyone get's their demo unit.

 

[Daniel Nenni]

An extra 2 quarters of data turns vs TSMC is a pretty big deal. This is especially valuable because intel has fewer possible data turns to get high-NA to the maturity level needed to replace some low-NA SALELE layers for 14A than TSMC has for A14 due to intel trying to get 14A out first. Either way as I have said for well over a year now, the real tell is who gets the next 10 units once everyone get's their demo unit.

Hard to believe it would NOT be Intel since they are doing chiplets. The question for TSMC and Samsung Foundry is when will Intel Foundry be able to do complex HNA-EUV chips for customers? If Intel Foundry has a jump with HNA-EUV that could win some customer business, absolutely.

 

[Fred Chen]

An extra 2 quarters of data turns vs TSMC is a pretty big deal. This is especially valuable because intel has fewer possible data turns to get high-NA to the maturity level needed to replace some low-NA SALELE layers for 14A than TSMC has for A14 due to intel trying to get 14A out first. Either way as I have said for well over a year now, the real tell is who gets the next 10 units once everyone get's their demo unit.

I doubt they even have their mask structure and pellicle tuned. And they still have to get their stitching together, so to speak.