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ASML: High NA EUV assembly accelerated, Intel completed the second set

Daniel Nenni

Admin
Staff member
ASML: High NA EUV assembly accelerated, Intel completed the second set

When Christophe Fouquet, the new CEO of ASML, attended the SPIE conference, he introduced the High NA EUV exposure machine and confirmed that Intel's second set of High NA EUV exposure machine has been assembled.

Christophe Fouquet said that High NA EUV will be unlikely to be delayed like standard EUV because ASML has found a new way to assemble scanner subassemblies, which is to install it directly at the customer's factory without the need to go through disassembly and reassembly, which greatly saves ASML and customers time. time and cost, helping to speed up High NA EUV shipment and delivery.

Christophe Fouquet was followed by Intel academician and exposure technology director Mark Phillips. Intel has completed the installation of two High NA EUV systems in the Portland factory. Mark Phillips also explained that compared with the improvement of standard EUV, the improvement results of High NA EUV applications may be more than imagined.

Mark Phillips emphasized that the second High NA EUV system was installed faster than the first one due to previous experience. All High NA EUV infrastructure is in place and operational, and High NA EUV mask inspection begins as planned. Intel doesn't need much support to get it into production.

Mark Phillips was asked about CAR (chemically amplified resists) versus metal oxide resists. He said that CAR is still sufficient, but metal oxide photoresist will be needed at some point in the future. Intel's goal is to mass-produce the Intel 14A process in 2026~2027, and the process will be improved by then.

 
Two machines for about one billion dollars. I hope the outlook is as positive as Mark Phillips thinks it might be.
 
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No discount/offers for pre ordering?
Gelsinger once described the High NA price as "$400million-ish". Perhaps that is the discounted price. :) Gelsinger didn't mention if that included installation and set-up, which must be huge. I also suspect shipping costs vary widely, because I'd guess it would be significantly cheaper to ship one of these things to Oregon than to Taiwan or South Korea from western Europe.
 
Two machines for about one billion dollars. I hope the outlook is as positive as Mark Phillips is thinks it might be.
Actually, we can watch closely at intel's NA EUV progress in recently SPIE conferences. All engineering data look very positive.
I remembered EUV HVM was triggered by the news from IBM about 10 years ago. I am waiting for more data of pre-productivity test ad start Hi NA EUV Lithography era soon.

https://www.eetimes.com/ibm-breaks-euv-throughput-record/
 
Christophe Fouquet said that High NA EUV will be unlikely to be delayed like standard EUV because ASML has found a new way to assemble scanner subassemblies, which is to install it directly at the customer's factory without the need to go through disassembly and reassembly, which greatly saves ASML and customers time. time and cost, helping to speed up High NA EUV shipment and delivery.
These systems will have to be disassembled if they are to be moved to another fab site, as happened before: https://semiwiki.com/forum/index.ph...ack-and-scanner-from-oregon-to-ireland.15828/ This might be expected if the HNA parts output is not as high as needed.
 
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