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As we are witnessing the significant shift in Packaging Technologies I wanted to ask the group for recommendation for any available formal training / classes at a university or any other forum on the topic of Advanced Packaging, covering the various technologies and trends in 2.5 and 3D packaging, WLP, WLSI, TSV, etc.
Thanks in advance.
Most of what you need to know is being shared at conferences and by specific companies active in the packaging field. Major conferences include: ISCC, DAC, DesignCon, SemiCon, DVCon.
Thanks Daniel.
I am aware of those, and there is a lot of material available on the WEB including presentations and papers from the various conferences and trade shows.
I was wondering if there were any formal training or classes anywhere.
It may be that most packaging engineerings have on-the-job training instead of a formal classroom. Like many industrial processes it is a very competitive business, so it is an advantage for companies to hoard the information and not give it away at a University....
You are right. At this stage there is no unified standard and the various players are keeping the cards close to the chest hoping that "their" standard will prevail.
As we are witnessing the significant shift in Packaging Technologies I wanted to ask the group for recommendation for any available formal training / classes at a university or any other forum on the topic of Advanced Packaging, covering the various technologies and trends in 2.5 and 3D packaging, WLP, WLSI, TSV, etc.
Thanks in advance.
We here at Semitracks have some course materials available in that area, both online and in-person. Please feel free to contact me if you would like further information.
Best regards, Chris