3D Architectures for Semiconductor Integration and Packaging (3D ASIP), now in its 11th year, is the longest continuing conference series on the topic of 3D ASIP. This conference provides a unique meeting point, dedicated to serving the needs of the entire 2.5/3D ecosystem, from design through process development and manufacturing.
December 10-12 Burlingame, CA (near SFO Airport)
The conference offers invited speakers from leading companies and organizations around the world a platform for sharing the latest information on technology progress and industry trends that define this sector today and tomorrow. 2014 Conference Co-chairs are Michael Ma, VP, Research and Development,
Siliconware Precision Industries and Phil Garrou, IEEE Fellow and Consultant, Microelectronics Consultants of NC.
Mark your calendar and make plans to attend 3D ASIP 2014.The agenda is currently in development and will be released in early September. Early Registration is open.
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December 10-12 Burlingame, CA (near SFO Airport)
The conference offers invited speakers from leading companies and organizations around the world a platform for sharing the latest information on technology progress and industry trends that define this sector today and tomorrow. 2014 Conference Co-chairs are Michael Ma, VP, Research and Development,
Siliconware Precision Industries and Phil Garrou, IEEE Fellow and Consultant, Microelectronics Consultants of NC.
Mark your calendar and make plans to attend 3D ASIP 2014.The agenda is currently in development and will be released in early September. Early Registration is open.
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