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TSMC Crosses 90% 2nm Yields, Arizona US Plant Close To 100% Capacity With NVIDIA’s AI Chip Slated For Production – Reports

Daniel Nenni

Admin
Staff member
TSMC AZ Land.jpg


NVIDIA's AI chip is slated to enter mass production at TSMC's US site by the end of this year, suggests a new report from the Taiwanese press. TSMC's Arizona fab, which started producing chips earlier this year, is the bedrock of the firm's manufacturing presence in the US. Analysts suggest that the site can reach complete capacity utilization soon as the Taiwanese firm contends with orders from major American technology companies, including NVIDIA, Apple, Qualcomm, AMD and Broadcom. Reports of strong demand at the Arizona site are accompanied by others who share that TSMC's yield for its leading-edge 2-nanometer process has exceeded 90% for memory products.

TSMC's Arizona Site Close To 100% Capacity Utilization With Orders From Apple, NVIDIA & Others Flowing In
According to a report in the Taiwanese press, Apple continues to be TSMC's largest customer in its Arizona site and will be the first to receive chips from the plant. TSMC is currently producing its N4 chips in Arizona. N4 is for chips branded 5-nanometer and 4-nanometer, and according to the details, NVIDIA's AI chips are currently undergoing process verification at the US site. These chips will enter production by the end of this year, suggest sources.

Reports of booming demand at the Arizona site are accompanied by others who share that the factory could increase chip prices by as much as 30%. Industry insiders believe higher US manufacturing costs are to blame for the price hikes. They might also be driven by high capacity utilization at the plant, with Nobunaga Chai of Cloud Express holding the opinion that the Arizona facility is producing 15,000 12-inch wafers per month and will expand its capacity to 24,000 soon, the facility's peak capacity.

As it racks up orders for its Arizona site, TSMC is also making strong progress with its 2-nanometer chip manufacturing process. According to the Taiwanese press, the firm has achieved yields greater than 90% for its leading-edge technology. Yields refer to the percentage of usable chips in a silicon wafer, and higher yields mean that chip manufacturers do not have to absorb the costs of manufacturing defective products.

The high yields are for memory products, with TSMC receiving four times the tape-outs for its 2-nanometer process over the 5-nanometer node. A tape-out is a finalized chip design, which is the last stage of the process before manufacturing. Analysts are using revenue and demand for wafer-cutting and polishing companies as a proxy to ascertain the demand for TSMC's 2-nanometer and 3-nanometer processes.

Two firms, namely the Kinik Company and Phoenix Silicon International Corporation, are experiencing greater demand for their diamond disc tools. According to market reports, Kinik holds a 70% market share for TSMC's 3-nanometer process technology. The firm has increased its monthly production capacity to 50,000 discs, with sources adding that as TSMC increases 2-nanometer production, its disc revenue will mark sequential (quarter-over-quarter) growth.

Diamond discs are part of a process in chip manufacturing called Chemical Mechanical Planarization (CMP). Chip manufacturers employ the discs to ensure that wafer surfaces are free of impurities before manufacturing and to remove excess materials after billions of tiny circuits have been printed on a wafer to create chips.

 
I love rumor sites that reference their own site for more even rumors :ROFLMAO:

Reports of booming demand at the Arizona site are accompanied by others who share that the factory could increase chip prices by as much as 30%. Industry insiders believe higher US manufacturing costs are to blame for the price hikes.

Reports, rumors, same thing I guess? Complete nonsense.
 
"Memory products" => they mean SRAM?

Yes, has to be. Now way is the new AMD N2 design at 90% yield.

Very bad reporting. Stay in your lane Ramish.

Ramish ZafarSenior Editor, Finance​

Ramish joined Wccftech in 2014 and since then has covered reports for high-end gadgets. Now, he has moved forward to covering pressing issues in the tech industry, earnings reports and analytical pieces for tech companies amongst other coverage.
 
Two firms, namely the Kinik Company and Phoenix Silicon International Corporation, are experiencing greater demand for their diamond disc tools. According to market reports, Kinik holds a 70% market share for TSMC's 3-nanometer process technology. The firm has increased its monthly production capacity to 50,000 discs, with sources adding that as TSMC increases 2-nanometer production, its disc revenue will mark sequential (quarter-over-quarter) growth.


Diamond discs are part of a process in chip manufacturing called Chemical Mechanical Planarization (CMP). Chip manufacturers employ the discs to ensure that wafer surfaces are free of impurities before manufacturing and to remove excess materials after billions of tiny circuits have been printed on a wafer to create chips.

Kinik embeds thousands of diamonds in precise patterns on stainless steel disks. The CMP department disposes of 10s of these disks per day. Uniform, tiny industrial diamonds is one of the secrets of semiconductor manufacturing. Kinik's particular trick is to chemically bond the diamond to the metal, via a high temperature step, so the diamond doesn't fall out, scratching the wafer surface. The diamonds are also quite uniform and consistently placed, creating a grid.

Gemini:

The exact number of diamonds embedded in a Kinik diamond CMP disk is unavailable. This information is not found in the provided search results.
However, some information about their construction and characteristics is available:
  • Diamond Grits: Kinik's CMP disks use diamond particles embedded on a metallic substrate.
  • Bonding Methods: These diamonds are typically attached through electroplating nickel, sintering metal powder, or brazing with a specialized alloy.
  • DiaGrid Technology: Kinik uses DiaGrid technology, which involves a diamond grid pattern on the disk surface. This grid provides efficient dressing of the polishing pad with a uniform distribution of diamond particles, reducing the chance of diamond chipping or pullout.
  • Diamond Size and Spacing: One Kinik DiaGrid disk example has a diameter of 100mm, with a diamond spacing of 300 μm and a diamond protrusion of 60 μm.
  • Purpose: The diamonds in Kinik's CMP disks condition or "dress" the polishing pad surface during the chemical mechanical planarization (CMP) process. This process prepares the pad for polishing semiconductor wafers, ensuring optimal removal rates and uniformity.
  • Advancements: Kinik's Pyradia disks use a combination of high diamond strength, diamond shaping technology, and individually fixed diamond placement for superior performance.
Kinik CMP disks are designed with a controlled arrangement of diamond grits, likely a substantial quantity depending on the disk size and application.
 
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