Richard CHENRichard CHEN • | SemiconductorsMarketing Analyst |
China's wafer foundry players are continuing to scale up capacity, especially in mature process nodes—a move that could put increasing pricing pressure on global foundries relying on legacy nodes.


SMIC's Semiconductor Manufacturing South China (SMSC) is slightly increasing its advanced-node capacity (14nm and below), while Nexchip N3 Fab is ramping up to produce 100,000 wafers/month at 55nm and 40nm nodes, with a focus on high-end CIS (CMOS Image Sensors).

1. SMIC Beijing (SMBC): Two-phase construction. Once completed, monthly 12-inch wafer capacity will hit 100,000 units.
2. Huahong Wuxi Phase-2: Targeting automotive chips. Production starts post-December 2024, scaling to 20,000 wafers/month in Q4 2025 and 83,000/month by 2027.

Huahong has acquired GlobalFoundries’ Chengdu fab. Production is expected to start by the end of 2026, aiming for 30,000 wafers/month under subsidiary HLMC.

Let’s keep an eye on how this shapes the global semiconductor supply chain going forward.