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SAN FRANCISCO (Reuters) - Intel CEO Lip-Bu Tan met recently with Taiwan Semiconductor Manufacturing Co's CEO to discuss how the two companies could collaborate, Tan said during a conference call with analysts on Thursday.
"We clearly view TSMC as our partner, and they have been very good partners to have. (Retired TSMC founder) Morris (Chang) and (CEO) CC (Wei) are very long-time friends of mine. We also met recently (to) try to find areas we can collaborate and so that we can create a win, win situation," Tan said on a call after Intel reported its quarterly results.
Wei was in Silicon Valley this week as TSMC held its annual technology conference. Tan also attended the conference, according to two Reuters witnesses who saw him there.
Yes Lip-Bu was at the TSMC event, he attends every year. Last year it was as a partner (Cadence), this year it was as a customer (Intel). I spoke briefly with him, Lip-Bu is a happy man in general but he seemed very upbeat. My guess is that Lip-Bu is trying to get a better wafer agreement with some packaging. Last year CC Wei said all but one N3 customer was moving to N2 with a smirk. That one customer was Pat Gelsinger. At the event I was told that ALL N3 customers will use N2 so maybe Intel is on board for more TSMC wafers. In the hallway I was told the first N2 based Intel chip would be a GPU. Just a rumor......
"Wei was in Silicon Valley this week as TSMC held its annual technology conference. Tan also attended the conference, according to two Reuters witnesses who saw him there."
