siliconbruh999
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After Intel's new CEO Lip-Mo Chen took office, Intel's wafer foundry quickly caught up. Intel 18A introduced BSPDN (back side power delivery) technology earlier than TSMC A16, and the CPU will aim to have a 70% self-production rate. According to the supply chain, for Panther Lake, the Compute tile will use Intel 18A, and the next-generation Nova Lake Compute tile will not be entirely outsourced.
ASIC manufacturer Faraday pointed out that the 18A platform tape-out was completed in October last year, and that samples have been received and successfully connected.
Lip-Wu Chen is scheduled to deliver a keynote speech at Intel Foundry Direct Connect in San Jose, California on the 29th of this month, and is scheduled to come to Taiwan in mid-May. In addition to coming to Taiwan before participating in the Taipei International Computer Show, he will also attend Intel's 40th anniversary in Taiwan.
Intel's five-node policy over the past four years has shown some results. Taiwanese ASIC manufacturers that cooperated with it revealed that they have recently received chip samples that were put into production on Intel's 18A process last year. The chip samples are currently in the testing phase and the verification results are good.
It is reported that Nvidia and Broadcom are also actively conducting manufacturing tests.
Supply chain sources indicate that the important Compute tile of Panther Lake, which will be launched in the second half of this year, will adopt the internal Intel 18A process, while the Graphic tile and SoC tile will be outsourced to TSMC. Next year's Nova Lake will expand outsourcing, with some Compute tiles being manufactured by TSMC's 2nm process, but some models will still use internal processes.
IC industry insiders pointed out that Intel 18A is the first to adopt the industry's first back-end power supply technology, which will further improve density and unit utilization. TSMC's A16 process, which is comparable to this technology, will not be launched until the second half of next year, so the chip giant is eager to try it out; in addition, price and geopolitics also contributed to the push.
Google Translated
Source in Chinese:
ASIC manufacturer Faraday pointed out that the 18A platform tape-out was completed in October last year, and that samples have been received and successfully connected.
Lip-Wu Chen is scheduled to deliver a keynote speech at Intel Foundry Direct Connect in San Jose, California on the 29th of this month, and is scheduled to come to Taiwan in mid-May. In addition to coming to Taiwan before participating in the Taipei International Computer Show, he will also attend Intel's 40th anniversary in Taiwan.
Intel's five-node policy over the past four years has shown some results. Taiwanese ASIC manufacturers that cooperated with it revealed that they have recently received chip samples that were put into production on Intel's 18A process last year. The chip samples are currently in the testing phase and the verification results are good.
It is reported that Nvidia and Broadcom are also actively conducting manufacturing tests.
Supply chain sources indicate that the important Compute tile of Panther Lake, which will be launched in the second half of this year, will adopt the internal Intel 18A process, while the Graphic tile and SoC tile will be outsourced to TSMC. Next year's Nova Lake will expand outsourcing, with some Compute tiles being manufactured by TSMC's 2nm process, but some models will still use internal processes.
IC industry insiders pointed out that Intel 18A is the first to adopt the industry's first back-end power supply technology, which will further improve density and unit utilization. TSMC's A16 process, which is comparable to this technology, will not be launched until the second half of next year, so the chip giant is eager to try it out; in addition, price and geopolitics also contributed to the push.
Google Translated
Source in Chinese: