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Samsung Electronics Begins Development of 1nm, the ‘Dream Semiconductor Process’

Daniel Nenni

Admin
Staff member
- Establishing a dedicated development organization in the semiconductor research institute
- Mass production is expected to begin after 2029
- TSMC Announces 1.6nm Production Next Year

Photo = Created by OpenAI 'Dali'

Photo = Created by OpenAI 'Dali'

Samsung Electronics has started developing the 1.0㎚ (nanometer, 1 billionth of a meter) foundry process, which is called the dream semiconductor process. As there is a realistic gap with Taiwan's TSMC in technologies that are close to mass production, such as the 2㎚ process, the company plans to speed up the development of the 1㎚ process, a future technology, to create an opportunity for a turnaround.

According to industry sources on the 9th, Samsung Electronics Semiconductor Research Institute recently began developing a 1.0 nanometer process. Some researchers who participated in the development of cutting-edge processes such as 2 nanometers were transferred to form a project team. 1.0 nanometers is called the dream semiconductor process, and in the foundry process roadmap that Samsung Electronics has released so far, the 1.4 nanometer process scheduled for mass production in 2027 is the most advanced.

2GRGE16KDX_3.jpg


The 1.0 nanometer process requires a new technology concept that breaks the mold of existing designs as well as the introduction of next-generation equipment such as high-NA EUV exposure equipment. The company is targeting mass production after 2029.

Samsung Electronics is lagging behind TSMC in its technological prowess in the 3 nanometer process that is currently in mass production and the 2 nanometer process that is scheduled for mass production this year, so expectations for the 1 nanometer process are high. In the case of 2 nanometers, TSMC’s yield has already exceeded 60%, and the gap with Samsung Electronics is not small. In particular, it was reported that Chairman Lee Jae-yong started development of the 1 nanometer process early last month after urging executives to “continue the tradition of prioritizing technology” and emphasizing, “Let’s create the future with technology that doesn’t exist in the world.”

Competitors are also accelerating the development of 1 nanometer processes. Last April, TSMC made a surprise announcement that it would add 16A technology, meaning 1.6 nanometers, between the existing 1.4 nanometers and 2 nanometers and start production in the second half of 2026. This is an analysis that it is responding to the technological demand of the rapidly changing artificial intelligence (AI) semiconductor market and laying the foundation for the next-generation process.

Samsung Foundry Division, which recently replaced its leadership, is focusing on expanding its business ecosystem while strengthening its technological capabilities. Jin-man Han, head and president of Samsung Electronics Foundry Division, has recently been focusing on strengthening partnerships by meeting with domestic AI semiconductor startups such as DeepX to understand customer needs.

 
- Establishing a dedicated development organization in the semiconductor research institute
- Mass production is expected to begin after 2029
- TSMC Announces 1.6nm Production Next Year

Photo = Created by OpenAI 'Dali''Dali'

Photo = Created by OpenAI 'Dali'

Samsung Electronics has started developing the 1.0㎚ (nanometer, 1 billionth of a meter) foundry process, which is called the dream semiconductor process. As there is a realistic gap with Taiwan's TSMC in technologies that are close to mass production, such as the 2㎚ process, the company plans to speed up the development of the 1㎚ process, a future technology, to create an opportunity for a turnaround.

According to industry sources on the 9th, Samsung Electronics Semiconductor Research Institute recently began developing a 1.0 nanometer process. Some researchers who participated in the development of cutting-edge processes such as 2 nanometers were transferred to form a project team. 1.0 nanometers is called the dream semiconductor process, and in the foundry process roadmap that Samsung Electronics has released so far, the 1.4 nanometer process scheduled for mass production in 2027 is the most advanced.

2GRGE16KDX_3.jpg


The 1.0 nanometer process requires a new technology concept that breaks the mold of existing designs as well as the introduction of next-generation equipment such as high-NA EUV exposure equipment. The company is targeting mass production after 2029.

Samsung Electronics is lagging behind TSMC in its technological prowess in the 3 nanometer process that is currently in mass production and the 2 nanometer process that is scheduled for mass production this year, so expectations for the 1 nanometer process are high. In the case of 2 nanometers, TSMC’s yield has already exceeded 60%, and the gap with Samsung Electronics is not small. In particular, it was reported that Chairman Lee Jae-yong started development of the 1 nanometer process early last month after urging executives to “continue the tradition of prioritizing technology” and emphasizing, “Let’s create the future with technology that doesn’t exist in the world.”

Competitors are also accelerating the development of 1 nanometer processes. Last April, TSMC made a surprise announcement that it would add 16A technology, meaning 1.6 nanometers, between the existing 1.4 nanometers and 2 nanometers and start production in the second half of 2026. This is an analysis that it is responding to the technological demand of the rapidly changing artificial intelligence (AI) semiconductor market and laying the foundation for the next-generation process.

Samsung Foundry Division, which recently replaced its leadership, is focusing on expanding its business ecosystem while strengthening its technological capabilities. Jin-man Han, head and president of Samsung Electronics Foundry Division, has recently been focusing on strengthening partnerships by meeting with domestic AI semiconductor startups such as DeepX to understand customer needs.


They didn’t have the nerve to slap "900pm" on their 1nm claim, because even they know it’s all smoke and mirrors when their 3nm is barely a blueprint! 🤣
 
Indeed, what is the point of 1.4nm or even 1.0nm, if one company cannot even solve the production yield issues of 3nm and 2nm? The wise strategy is to shift the R & D resources to optimize every single process module step by step to improve the overall process performance, rather than jumping back and forth like a monkey with a moving focus. Personally I can tell this may be simply explained by certain newly assigned leadership eager to show that they are working hard to push the technology development. But nobody want to see this kind of old story!
 
I feel like Samsung should have started A10 development sooner than this. TSMC said they were extending development times to 5-7 years, and even back in 2008 when things were simpler, Intel said they started full process development 4 years before products came to market. Even if we are talking about A10 HVM start and not products out the door, 2029 seems high risk if they are only just starting development in 2025. And that is before we consider that Samsung doesn't exactly have a proven record of process execution excellence like TSMC or Intel. But who knows, SF2 in 2025 might finally iron out all of the worts on SF3, improve yield to satisfactory levels, and tighten up the variation enough for a mobile-AP designer to not feel embarrassed having their design on the process. People made similar comments when Intel was saying 18A HVM start in 2024 and products in 2025. Heck, people didn't even think Intel 4 HVM in 2022 with products in 2023 was reasonable either. Yet baring a design related delay, here we are with Intel pulling out a small and short-lived process lead over TSMC until 2026. I guess, who's to say we aren't at the beginning of a Samsung recovery? But I don't think we have seen enough information pointing to enough being different to have any reason to think things will turn out different.
 
I feel like Samsung should have started A10 development sooner than this. TSMC said they were extending development times to 5-7 years, and even back in 2008 when things were simpler, Intel said they started full process development 4 years before products came to market. Even if we are talking about A10 HVM start and not products out the door, 2029 seems high risk if they are only just starting development in 2025. And that is before we consider that Samsung doesn't exactly have a proven record of process execution excellence like TSMC or Intel. But who knows, SF2 in 2025 might finally iron out all of the worts on SF3, improve yield to satisfactory levels, and tighten up the variation enough for a mobile-AP designer to not feel embarrassed having their design on the process. People made similar comments when Intel was saying 18A HVM start in 2024 and products in 2025. Heck, people didn't even think Intel 4 HVM in 2022 with products in 2023 was reasonable either. Yet baring a design related delay, here we are with Intel pulling out a small and short-lived process lead over TSMC until 2026. I guess, who's to say we aren't at the beginning of a Samsung recovery? But I don't think we have seen enough information pointing to enough being different to have any reason to think things will turn out different.

Are you saying that Intel's 18A HVM started in 2024.
 
Last edited:
"Competitors are also accelerating the development of 1 nanometer processes. Last April, TSMC made a surprise announcement that it would add 16A technology, meaning 1.6 nanometers, between the existing 1.4 nanometers and 2 nanometers and start production in the second half of 2026. This is an analysis that it is responding to the technological demand of the rapidly changing artificial intelligence (AI) semiconductor market and laying the foundation for the next-generation process."

TSMC don't have an "existing 1.4nm" process, and A16 process is pretty much N2 with BSPD -- same transistors/metal geometry (except for BSPD), it's certainly not "1.6nm" except on marketing slides. IIRC it was always planned for late 2026, maybe they've just pulled it in a bit to compete with Intel 18A which also has BSPD. I seem to remember predicting exactly this last year... ;-)
 
- Establishing a dedicated development organization in the semiconductor research institute
- Mass production is expected to begin after 2029
- TSMC Announces 1.6nm Production Next Year

Photo = Created by OpenAI 'Dali''Dali'

Photo = Created by OpenAI 'Dali'

Samsung Electronics has started developing the 1.0㎚ (nanometer, 1 billionth of a meter) foundry process, which is called the dream semiconductor process. As there is a realistic gap with Taiwan's TSMC in technologies that are close to mass production, such as the 2㎚ process, the company plans to speed up the development of the 1㎚ process, a future technology, to create an opportunity for a turnaround.

According to industry sources on the 9th, Samsung Electronics Semiconductor Research Institute recently began developing a 1.0 nanometer process. Some researchers who participated in the development of cutting-edge processes such as 2 nanometers were transferred to form a project team. 1.0 nanometers is called the dream semiconductor process, and in the foundry process roadmap that Samsung Electronics has released so far, the 1.4 nanometer process scheduled for mass production in 2027 is the most advanced.

2GRGE16KDX_3.jpg


The 1.0 nanometer process requires a new technology concept that breaks the mold of existing designs as well as the introduction of next-generation equipment such as high-NA EUV exposure equipment. The company is targeting mass production after 2029.

Samsung Electronics is lagging behind TSMC in its technological prowess in the 3 nanometer process that is currently in mass production and the 2 nanometer process that is scheduled for mass production this year, so expectations for the 1 nanometer process are high. In the case of 2 nanometers, TSMC’s yield has already exceeded 60%, and the gap with Samsung Electronics is not small. In particular, it was reported that Chairman Lee Jae-yong started development of the 1 nanometer process early last month after urging executives to “continue the tradition of prioritizing technology” and emphasizing, “Let’s create the future with technology that doesn’t exist in the world.”

Competitors are also accelerating the development of 1 nanometer processes. Last April, TSMC made a surprise announcement that it would add 16A technology, meaning 1.6 nanometers, between the existing 1.4 nanometers and 2 nanometers and start production in the second half of 2026. This is an analysis that it is responding to the technological demand of the rapidly changing artificial intelligence (AI) semiconductor market and laying the foundation for the next-generation process.

Samsung Foundry Division, which recently replaced its leadership, is focusing on expanding its business ecosystem while strengthening its technological capabilities. Jin-man Han, head and president of Samsung Electronics Foundry Division, has recently been focusing on strengthening partnerships by meeting with domestic AI semiconductor startups such as DeepX to understand customer needs.


Once again, Samsung leaps ahead! :)
 
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