2024/01/31 02:13:29
Economic Daily Comprehensive Report
TSMC did not comment on relevant rumors yesterday (30th). According to industry sources, after Intel joins Huida's AI chip advanced packaging supply chain, Huida's total advanced packaging production capacity will be significantly increased by nearly 10%.
According to industry analysis, even if Intel joins to provide Huida's advanced packaging production capacity, TSMC will still be Huida's main advanced packaging supplier. If we add up the production expansion of TSMC and other packaging and testing partners, the total supply of Huida's advanced packaging production capacity is about 90%.
Supply and revealed that TSMC is sprinting to expand its advanced packaging production capacity. The monthly production capacity in the first quarter of this year is expected to increase to nearly 50,000 pieces, an increase of 25% from the nearly 40,000 pieces estimated in December last year. As for Intel, it may provide Huida with nearly 5,000 pieces of advanced packaging production capacity, which accounts for nearly 10%. However, Intel is not involved in Huida's AI chip wafer foundry orders.
Intel has advanced packaging production capabilities in Oregon and New Mexico in the United States, and is actively expanding advanced packaging at its new factory in Penang. It is worth noting that Intel has previously stated that its openness allows customers to choose only its advanced packaging solutions, with the goal of giving customers more production flexibility.
According to analysis by industry insiders, the previous shortage of AI chips mainly came from three parts. In addition to insufficient advanced packaging production capacity and tight high-bandwidth memory (HBM3) production capacity, some cloud service providers also placed repeated orders. Now, related blocking factors It has been gradually eliminated and the improvement is faster than expected.
The industry believes that the accelerated supply of AI chips will benefit the entire industry chain in terms of shipments.
Last year, Huida was affected by a large shortage of AI chips. Even if there were orders for AI server assembly plants, they were unable to meet customer demand. Quanta stated bluntly a few days ago that there is no problem with the demand for AI servers. On the contrary, there are more and more of them. The main problem lies on the supply side. As the shortage of materials eases, shipments will strengthen from May and June.
Inventec has also been actively pursuing its AI server business in recent years. Affected by the shortage of materials in the market, it has dragged down the shipment momentum of high-end products. If the shortage of server materials is alleviated, shipments this quarter are expected to turn smooth. Inventec expects that AI server shipments are expected to double this year. Last year, related revenue accounted for about 5% to 6%, and this year it will break through the 10% mark.
Ye Peicheng, chairman of GIGABYTE, previously said that this wave of AI has just started in 2024, and this wave of AI is coming relatively quickly. The supply of AI server chips in the first half of this year is the key, and there is no doubt about the demand side, but the supply side is still very tight in the first half of the year.
money.udn.com
Economic Daily Comprehensive Report
TSMC did not comment on relevant rumors yesterday (30th). According to industry sources, after Intel joins Huida's AI chip advanced packaging supply chain, Huida's total advanced packaging production capacity will be significantly increased by nearly 10%.
According to industry analysis, even if Intel joins to provide Huida's advanced packaging production capacity, TSMC will still be Huida's main advanced packaging supplier. If we add up the production expansion of TSMC and other packaging and testing partners, the total supply of Huida's advanced packaging production capacity is about 90%.
Supply and revealed that TSMC is sprinting to expand its advanced packaging production capacity. The monthly production capacity in the first quarter of this year is expected to increase to nearly 50,000 pieces, an increase of 25% from the nearly 40,000 pieces estimated in December last year. As for Intel, it may provide Huida with nearly 5,000 pieces of advanced packaging production capacity, which accounts for nearly 10%. However, Intel is not involved in Huida's AI chip wafer foundry orders.
Intel has advanced packaging production capabilities in Oregon and New Mexico in the United States, and is actively expanding advanced packaging at its new factory in Penang. It is worth noting that Intel has previously stated that its openness allows customers to choose only its advanced packaging solutions, with the goal of giving customers more production flexibility.
According to analysis by industry insiders, the previous shortage of AI chips mainly came from three parts. In addition to insufficient advanced packaging production capacity and tight high-bandwidth memory (HBM3) production capacity, some cloud service providers also placed repeated orders. Now, related blocking factors It has been gradually eliminated and the improvement is faster than expected.
The industry believes that the accelerated supply of AI chips will benefit the entire industry chain in terms of shipments.
Last year, Huida was affected by a large shortage of AI chips. Even if there were orders for AI server assembly plants, they were unable to meet customer demand. Quanta stated bluntly a few days ago that there is no problem with the demand for AI servers. On the contrary, there are more and more of them. The main problem lies on the supply side. As the shortage of materials eases, shipments will strengthen from May and June.
Inventec has also been actively pursuing its AI server business in recent years. Affected by the shortage of materials in the market, it has dragged down the shipment momentum of high-end products. If the shortage of server materials is alleviated, shipments this quarter are expected to turn smooth. Inventec expects that AI server shipments are expected to double this year. Last year, related revenue accounted for about 5% to 6%, and this year it will break through the 10% mark.
Ye Peicheng, chairman of GIGABYTE, previously said that this wave of AI has just started in 2024, and this wave of AI is coming relatively quickly. The supply of AI server chips in the first half of this year is the key, and there is no doubt about the demand side, but the supply side is still very tight in the first half of the year.
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