Webinar: Multiphysics Simulation of Challenges in 3D IC and Chiplet Designs

Online

Multiple Sessions - All English Language: 14:00 JST (APAC) 10:00 EDT, 16:00 CET (AMER and EUR) Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and …

Webinar: Digital Twin for Multi-physics Systems – How to Verify and Optimize Performance at the Overall Product Level

Online

Ensuring reliable performance of products in the field requires verification and validation at the system level. This means considering the complex interaction of different physics between systems and sub-systems. In …