The 16th IEEE International Memory Workshop (IEEE IMW) will be held in 2024 in Seoul. It is currently planned as an on-site event. This conference brings the memory community together …
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About IEEE ICC 2024 IEEE International Conference on Communications (ICC) is one of two IEEE Communications Society’s flagship conferences (ICC and Globecom). Each year, close to 2,000 attendees from over 70 …
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Welcome to Nuclear & Space Radiation Effects Conference On behalf of the Institute of Electrical and Electronics Engineers (IEEE), its Nuclear and Plasma Sciences Society (NPSS), the Radiation Effects Steering …
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6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read …
About the Symposium Phased array systems continue to be a rapidly evolving technology with steady advances motivated by the challenges presented to modern military and commercial applications. This symposium will present the most recent advances in phased array technology and offer a unique opportunity for members of the international community to interact with colleagues in …
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2024 IEEE NSS MIC RTSD 26 OCT – 2 NOV 2024 TAMPA , FLORIDA, USA For the sixth time, our conference returns to sunny Florida, but this time, with a …
The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. Call for Papers Jointly sponsored by IEEE and ACM, ICCAD …
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The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …
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About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …
IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM …
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Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE
