IEEE/EPS Hybrid Bonding Symposium
SEMI World Headquarters 673 South Milpitas Blvd, MilpitasHybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the …