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On behalf of the organizing committee, it is my great honor and pleasure to welcome you to Yokohama, Japan, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), September 27－October 2, 2026. The ICSCRM conference series is the premier international forum focusing on all aspects of silicon carbide and related materials. … |
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The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging … |
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About Shaping the future of AI The AI Conference was founded on a clear belief: AI is not a standalone technology—it is becoming the foundation of modern software, infrastructure, and business. Since launching in 2023, the conference has focused relentlessly on applied AI: how AI systems are actually built, deployed, governed, and scaled in the real world. Why What … 
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements … 
Where the Microelectronics Ecosystem Converges Semiconductors • Photonics • Embedded Systems Connecting the entire value chain — from R&D to manufacturing, packaging, testing and deployment. Microelectronics UK brings together engineers, technical leaders and technology providers from across the microelectronics ecosystem — spanning semiconductors, photonics and embedded systems — for two days of technical insight, collaboration and commercial … |
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Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements … |
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3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees will interact with researchers from all around the world. REGISTER HERE |
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Plan Today to Attend and Participate at ISTFA 2026! With a focus on both theoretical and practical applications, ISTFA 2026 promises to be an invaluable platform for professionals looking to enhance their expertise and stay at the forefront of microelectronics testing and failure analysis. This premier gathering is your one-stop destination for leading-edge training, networking, … |
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What is the Design Solution Forum? The Design Solution Forum is a technical forum that started in 2014 as a place for engineers to discuss software and hardware design methodologies for embedded systems. Planned and run by engineers, the forum operates under the basic concept of "Let's create and expand the designer network," and holds … |
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Keynote Speaker Shankar Krishnamoorthy Chief Product Development Officer Shankar Krishnamoorthy is the Chief Product Development Officer of Synopsys, an industry-leading company delivering engineering solutions from silicon to systems powering the era of pervasive intelligence. A Day of Innovation, Insight & Collaboration. Join us for the 2026 Synopsys Central Europe Technology Symposium - our gathering of engineers, innovators, and … Continue reading "Synopsys Central Europe Technology Symposium 2026" |
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International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how … |
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✓ Public Registration is now open. Click here for important registration information. Tickets are limited and may sell out in advance of the show. ✓ Hotel room blocks are now available Click here to book. The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around … |
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Where the Global Microelectronics Industry Connects, Innovates, and Leads October 13–15, 2026 | Moscone Center | San Francisco, CA SEMICON West returns to San Francisco, bringing together the world’s leading semiconductor companies, technology innovators, policymakers, engineers, researchers, and business leaders driving the future of microelectronics. From AI and advanced packaging to smart manufacturing, sustainability, mobility, … |
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Event Summary CadenceCONNECT Photonics is back, and this year, we're marking a decade of transformation in the photonic IC industry. Join Cadence and industry leaders on October 14 and 15, 2026. Ten years ago, photonic ICs were a promising idea sitting on the edge of the possible. Immature design flows. Limited manufacturing. An unproven business case. Today? The tooling is there. … |
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About GTS Hosted across the globe, GTS is GlobalFoundries’ annual flagship event, where GF and industry leaders, technologists, customers and partners explore how disruptive technologies are shaping intelligent systems and the semiconductor industry as a whole. Each GTS event includes deep dives into the impact of GF’s differentiated solutions, results and innovations from our customers … Continue reading "GlobalFoundries Technology Summit 2026 Europe" 
ABOUT THE CONFERENCE Where Analytics Meets Innovation Introducing Exensio® Aurora — AI-first, highly scalable architecture for Exensio Analytics. At PDF Solutions CONNECT, we'll introduce Exensio Aurora, a purpose-built solution architecture designed to handle semiconductor manufacturing data at petabyte scale and to securely deploy agentic AI across manufacturing operations and the supply chain. Exensio Aurora draws on … |
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RISC-V Summit China 2026 will take place from October 18 to 20, 2026 at the Shenzhen Convention & Exhibition Center (Futian). As an important annual gathering for global open hardware and the RISC-V ecosystem, this Summit will bring together leading scientists, core architects, industry executives, technology developers, and ecosystem partners. The event is expected to … 
EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave … |
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Ready to share and discuss the latest design and verification best practices with your peers from around the world? It’s time for our annual Jasper User Group Conference - San Jose. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world to share the latest design and verification practices … |
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CASPA 35th Annual Conference & Dinner Banquet CEO Summit 2026 Registration Opens July 31 Celebrating 35 Years of Innovation & Leadership Join industry leaders from the semiconductor, AI, cloud, and systems ecosystem at CASPA’s flagship annual CEO Summit. October 23–24, 2026 Santa Clara Convention Center REGISTER HERE |
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ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large … |
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59th IEEE/ACM International Symposium on Microarchitecture The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. … |
