Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools

Online

Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …

Eurocrypt 2024

Kongresshaus Zurich Claridenstrasse 5, Zurich, Switzerland

Eurocrypt 2024, the 43rd Annual International Conference on the Theory and Applications of Cryptographic Techniques, will take place at Kongresshaus in Zurich, Switzerland on May 26-30, 2024. Eurocrypt 2024 is organized by …

TSMC 2024 China Technology Symposium

Shanghai International Convention Center (SHICC) No.2727, Riverside Avenue, Pudong, Shanghai, China

Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, …

Webinar: Shift Left in A/MS IC Design: Automation Methods for Early Layout Insights and Fast Iteration Loops

Online

Webinar Content Analog/mixed-signal IC design is a critical challenge for ASIC development with tight specifications and ambitious tapeout schedules that are not easy to meet. Many manual design steps from architecture through layout verification limit the amount of early insights and force time-consuming design iterations. In this webinar, we will give you an insight into …

WEBINAR – Advanced Semiconductor Packaging: Leading Patent Owners and New Entrants

Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have …

Webinar: Addressing Real-Time Workloads in Automotive Applications with Efficient ARC-V Processors

Online

Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT Many automotive applications require processing workloads with minimum latency and precise timing budgets.  This is especially true for safety-critical applications like adaptive cruise control and anti-lock braking, where human life may be jeopardized.  These systems require processing elements that can respond to events within specific (predictable) time …