ICCAD 2025
The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …
12 events found.
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Webinar: Rapid Design Space Exploration of AI functions on Lattice FPGAs using Catapult High-Level Synthesis
The increasing demand for accelerated computing solutions calls for an agile hardware design methodology to be able to keep up with fast evolving landscape of algorithms. Traditional hardware design methodology …
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CadenceCONNECT: Jasper User Group 2025
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world …
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Webinar: Accelerating RTL-to-GDS digital implementation with generative and agentic AI: powered by Aprisa AI & the Siemens EDA AI System
As digital chip design complexity grows, engineering teams face increasing pressure to meet aggressive PPA targets on tight schedules. To overcome this challenge, the EDA industry requires a revolutionary shift …
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Webinar: Exploring AMD Kria SOM for ROS 2 Multi-Node Communications with TSN Acceleration
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for …
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Webinar: 5 Expectations for the Memory Market in 2026
October 29, 2025 - 11:00 AM EST October 30, 2025 – 10:00 AM JST/KST Discover the 5 Critical Memory Market Trends Reshaping Semiconductors in 2026 AI workloads, HBM4 adoption, and …
Continue reading "Webinar: 5 Expectations for the Memory Market in 2026"
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Semitracks Course: Wafer Fab Processing
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
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Webinar: Advanced Packaging and Material Characterization for Microelectronics: SEMI Training
OnlineStrengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 …
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PIC Summit Europe 2025
Evoluon, Eindhoven Evoluon, Noord Brabantlaan 1A, Eindhoven, LA, NetherlandsScaling Together in a Dynamic World The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges for high-speed, energy-efficient solutions, the question isn’t if photonic chips will revolutionise industries, but how fast we can make it happen. At PIC Summit Europe 2025, we …
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Embedded World North America 2025
Anaheim, CA Anaheim, CA, United StatesConnect to the embedded community With its 20 years of history and experience in Europe, embedded world is the most professional and largest exhibition in its field, and has accumulated substantial industry and customer data and media resources. It gathers the leading enterprises of the global embedded industry, with its application range covering automotive electronics, …
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Webinar: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
OnlineNovember 4, 2025 | 10:00 AM PST This webinar will present advanced simulation tools and techniques for the design of GaN power amplifiers with increased assurance of stable operation that goes beyond simple k-factor analysis. The methods will be demonstrated using Qorvo GaN technology and related non-linear models that have been modified to facilitate advanced …
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Brooklyn 6G Summit 2025
New York University Tandon School of Engineering New York University Tandon School of Engineering, 6 MetroTech Center, Brooklyn, NY, United StatesWhat is the Brooklyn 6G Summit The Brooklyn 6G Summit (B6GS) is a premier event for the global communications industry, bringing together leading voices from technology, business, academia and regulation to shape the future of wireless. Jointly organized by Nokia and the NYU WIRELESS research center at the NYU Tandon School of Engineering, the Summit …