ABOUT US International Test Conference is the world's premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, …
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This course discusses the fundamentals of plasma assisted phenomena and reactive ion etching (RIE) processes. The emphasis is on the physical and chemical processes that determine the consequences of a …
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This online workshop introduces key concepts, tools, and techniques required for design and development using the AMD Vivado™ Design Suite for FPGAs, SoCs, and adaptive SoCs. The emphasis of this course is …
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Join processor IP experts from AKEANA as they explore why Simultaneous Multi-Threading (SMT) is becoming essential for next-generation SoC designs across AI, automotive, datacentre, and edge applications. This session unpacks …
Learn about Simulating Gate-All-Around Devices with Victory Atomistic As semiconductor devices push beyond FinFETs toward Gate-All-Around (GAA) architectures, accurate modeling at the nanoscale becomes essential. Join us for an in-depth …
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Wednesday, July 2, 2025 - Friday, October 31, 2025 Accelerating Inferencing Using HLS Hackathon Energy efficiency is essential for edge devices, especially those powered by batteries or harvested energy, making …
Welcome to SPEXA SPEXA or the Space business expo is Japan’s exhibition specialized in space business. It is poised to become the global business center hub that brings together companies …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Are FPGA booting challenges causing frustrating delays and leaving you uncertain about project timelines? Have …
Join your colleagues in beautiful San Diego. Make plans to attend and learn about latest insights, and breakthroughs. New this year - a symposium on Astronomical Applications. We are excited …
Space and Missile Defense - Defending America at Home and Abroad The SMD Symposium is the leading educational, professional development and networking event in the space and missile defense community. …
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FMS: the Future of Memory and Storage has expanded the scope of Flash Memory Summit to encompass all tiers of Memory and Storage. As a leading global independent conference and exhibition, …
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Date: Aug 05, 2025 | 10:00 AM PDT Featured Speakers: Priyank Shukla, Director of Product Management, Synopsys Kent Lusted, Distinguished Architect, Synopsys Why You Should Attend: Understand Industry Readiness: Explore the challenges and opportunities in the …
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Featured Speakers: Priyank Shukla, Director of Product Management, Synopsys Kent Lusted, Distinguished Architect, Synopsys Why You Should Attend: Understand Industry Readiness: Explore the challenges and opportunities in the race to 448G SerDes and …
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During the 39th Annual Small Satellite Conference, we will delve into the innovations, demands, and cross-market collaborations shaping the future of satellite capabilities and driving new opportunities allowing us to collectively …
Featured Speakers: Anders Blom, Principal Solutions Engineer, Synopsys Gabriele Penazzi, Senior Staff Engineer, Synopsys Vaida Arcisauskaite, Staff Engineer, Synopsys Join us to explore the transformative impact of atomistic simulations and …
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Where Inspiration Meets Innovation Join us on August 13 for CadenceLIVE India 2025 at the Sheraton Grand Bengaluru Whitefield Hotel & Convention Center, where Cadence technology users connect with the …
The 34th USENIX Security Symposium will take place on August 13–15, 2025, at the Seattle Convention Center in Seattle, WA, USA. The USENIX Security Symposium brings together researchers, practitioners, system programmers, and others interested in the latest advances in the security and privacy of computer systems and networks. The full symposium program will be available soon; view …
Architecting an SoC is a complicated step in building a successful chip. The first step is ensuring you have the critical requirements for your SoC captured so that the possible architectural options may be explored and the IP components that enable those architectures can be identified. Selecting the right IP can make or break your …
Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer …
