Share your research and join the outstanding program for 2025 Make plans to join the premier worldwide technical meeting for photomasks, patterning, metrology, materials, inspection/repair, mask business, extreme UV lithography, …
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The 28th edition of the European Microwave Week (EuMW 2025) will come to Utrecht to continue the annual series of highly successful microwave events that started back in 1998. EuMW …
About ITC International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design …
The North American Supply Chain Executive Summit is a premier gathering of industry leaders, supply chain executives, and experts dedicated to exploring innovative strategies, emerging trends, and best practices in …
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Speaker: Soo Chuan Tang, Principal Application Engineer 10:00am~11:00am Next-Generation Spectre FX FastSPICE Simulator and Spectre X Integration with GPU 11:00am~11:15am Q&A Description: Leveraging a FastSPICE engine built from the ground …
The Focus: The Global Product Data Interoperability Summit (GPDIS) functions as a communications hub for industry principals to foster knowledge through the exchange of ideas, solutions, and methods. It is …
The US Executive Forum is GSA’s most prestigious, invitation-only event, designed exclusively for industry leaders. This unique gathering unites influential executives, visionary thought leaders, and top subject matter experts for …
The Premier Event for the UK Microelectronics Industry Join thousands of your peers at the premier event uniting the entire value chains across the microelectronics, semiconductor, photonics and embedded systems …
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development results in the area of process and …
Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
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Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. When it comes to embedded software development, managing multiple tools, maintaining version control, and navigating …
Continue reading "Webinar: Getting Started with the Vitis Unified IDE"
Join industry leaders and Cadence cloud experts at this free must-attend Cloud event of the year to explore the latest cloud EDA innovations, share ideas, and grow your professional connections. All attendees …
The 51st European Conference on Optical Communication Welcome to ECOC 2025 in Copenhagen ECOC, the European Conference on Optical Communication, stands as Europe’s premier gathering for optical communications, holding a prominent …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
Continue reading "Semitracks Course: Failure and Yield Analysis"
Overview Join us for a series of expert-led webinars showcasing cutting-edge simulation and analysis tools—from RF/mmWave modeling to advanced thermal and electromagnetic solutions. While designed for a broad range of …
Lighting the Future: Advancing Silicon Photonics for the AI Connectivity Era Soitec is pleased to host a private workshop event in parallel of ECOC 2025, offering a forward-looking perspective on …
Join us at WISH, GSA WLI’s premier technical conference that promises to be an inspiring celebration of innovation and empowerment. With around 1,000 attendees, including industry luminaries, visionary entrepreneurs, and …
it-sa Expo&Congress in Nuremberg is Europe's largest trade fair for IT security... ...and one of the most important dialogue platforms for IT security solutions. The trade fair covers the entire …
SEMICON West 2025 makes its debut in Phoenix, October 7–9—positioning the city as a key hub for innovation and industry growth. This milestone event gathers global leaders across the microelectronics …
We're back in the vibrant city of Barcelona, bringing together experts from across the industry From 7th-9th October 2025, we’re reuniting the AutoSens community at the Palau de Congressos in …
What does the future hold for marine CFD simulation? Join us at the CadenceCONNECT: CFD Innovations for Marine Applications seminar to find out! Historic software uses methods for solving that …
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The OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to …
ABOUT PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The …
The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in …
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RISC-V is defining the future of open computing by providing unprecedented freedom to innovate. More than 13 billion RISC-V cores have shipped, powering new innovations in AI/ML, wireless, automotive, data …
Event Summary The year 2025 is both a turning point for integrated photonics as a key enabler for AI, physical and infrastructure interconnect, and the International Year of Quantum (IYQ). …
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Achieving Timing Closure in FPGA Designs Workshop Do you find it challenging to close timing in your FPGA design? This workshop will guide you through leveraging AMD Vivado’s tools, optimizing your design, …
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Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
Continue reading "2025 TSMC Open Innovation Platform Ecosystem Forum – Tokyo"
The 2025 International Conference on Computer-Aided Design Call For Papers Jointly sponsored by IEEE and ACM, IEEE ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, …
CadenceCONNECT: Jasper User Group 2025 is October 29 and 30 in San Jose, CA. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around the world …
Description BLT, an AMD Premier Design Services Partner and Authorized Training Provider, presents this webinar. Unlock the potential of the AMD Kria SOM and discover Time-Sensitive Networking (TSN) benefits for …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
On 6 and 7 November, Fraunhofer IZM is inviting customers and partners from industry to Berlin for its “Electronic Packaging Days”. The event is designed to facilitate direct exchange between …
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for …
Connecting the Dots: Empowering the Semiconductor Community SemIsrael Expo 2025 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields …
The International Conference for High Performance Computing, Networking, Storage, and Analysis HPC Ignites. St. Louis is the place to be this fall as the high performance computing community convenes for …
The Netherlands has been the home for Hardwear.io since 2015. We are very excited to host the industry from automotive, healthcare, semiconductor, IoT, industrial control systems and Govt/Defences Institutes to …
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Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
Continue reading "2025 TSMC Open Innovation Platform Ecosystem Forum – Taiwan"
The Component-based TPA and Virtual Prototyping Master Class is a 3-day live training event that brings together the NVH community at the NVH facility in Leuven, Belgium. This immersive program features theoretical …
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SEMICON Europa 2025 is co-located with productronica and will take place in November 18-21, 2025 in Munich, Germany. This year’s theme Global Collaborations for European Economic Resilience expresses that global collaborations are not …
Discover how the latest MEMS and imaging technologies are enabling next-level value creation across industries. Explore cutting-edge AI-enhanced sensing, data fusion, and their transformative impact on automotive, healthcare, and smart …
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From Theory to Practice: Applying Timing Constraints Workshop Do you struggle to identify which constraints are needed for a design or how to properly input them? This workshop will cover …
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Date: Nov. 20, 2025 Time: SIA Reception at 5:00 pm Dinner, Awards Presentations, & Keynote Remarks at 6:30 pm After-Dinner Reception at 8:30 pm Location: Signia by Hilton San Jose …
Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
Continue reading "2025 TSMC Open Innovation Platform Ecosystem Forum – Amsterdam"
Description Clock domain crossings (CDCs) are a critical aspect of FPGA and embedded system design, and handling them correctly is essential for reliable operation. In this one-hour webinar, we’ll break down CDC fundamentals, explore best practices for managing single-bit and bus CDCs, and demonstrate how to leverage Xilinx Parameterized Macros (XPM) for seamless synchronization. Join …
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Speaker: Hong-Cheang Quek, AE Director 10:00am~11:00am iPegasus Verification System for Virtuoso Studio 11:00am~11:15am Q&A Description: Today's complex SoC designs significantly increase layout creation and verification time, especially at advanced nodes. …
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Join us for the 2025 TSMC OIP ECOSYSTEM FORUM Get ready for an electrifying dive into the future of semiconductor design at the 2025 TSMC Global Open Innovation Platform® (OIP) Ecosystem …
Continue reading "2025 TSMC Open Innovation Platform Ecosystem Forum – China"
100 YEARS of FETs: SHAPING the FUTURE of DEVICE INNOVATIONS Inside IEEE IEDM 2025 Focus Sessions Focus Session #1 - Efficient AI Solutions: Architecture, Circuit, and 3D Integration Innovations for …
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Speaker: Kee Tat Ong, Principal Application Engineer 10:00am~11:00am Quantus Insight: Intelligent Parasitic Debugging, Optimization, and Signoff Closure 11:00am~11:15am Q&A Description: With more designs migrating to advanced process nodes, chips are …
Essential Debugging Techniques Workshop This workshop is for hardware engineers, system architects, and anyone who wants to learn best practices for debugging challenging issues encountered while developing FPGAs, SoCs, PCBs, …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's application-specific ICs and microprocessors can contain upwards of 100 million transistors. Traditional testing relies on …
Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating …
Continue reading "Semitracks Course: Failure and Yield Analysis"
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling …
Continue reading "Semitracks Course: Semiconductor Reliability and Product Qualification"
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar …
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