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SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing … |
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The premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated circuits. Dear Design, Verification and Validation Community, It is my great pleasure to welcome you to DVCon India 2026, taking place September 1-3, 2026, at Radisson Blu (Marathahalli) in Bengaluru, the vibrant hub … |
4 events,
About GTS Hosted across the globe, GTS is GlobalFoundries’ annual flagship event, where GF and industry leaders, technologists, customers and partners explore how disruptive technologies are shaping intelligent systems and the semiconductor industry as a whole. Each GTS event includes deep dives into the impact of GF’s differentiated solutions, results and innovations from our customers … Continue reading "GlobalFoundries Technology Summit 2026 North America"
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Designing AI inference hardware for edge applications often requires building custom hardware accelerated solutions to meet the demands for ultra-low power consumption and strict real-time response requirements. This webinar introduces Catapult™ AI NN, which provides an automated flow that starts with a Python neural network model and generates an RTL hardware accelerator. The flow enables rapid … |
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4 events,
Join your colleagues in Monterey for the premier worldwide photomask conference We invite you to explore the latest advances and breakthroughs at this annual conference in Monterey, California. Connect with leading scientists and engineers and discover new work across photomasks, patterning, metrology, materials, inspection and repair, mask business, extreme ultraviolet lithography, and emerging technologies. Connect … Continue reading "SPIE Photomask Technology + Extreme Ultraviolet Lithography" 
About DVCON DVCon Taiwan is the premier conference for design and verification engineers, researchers, and managers in Taiwan's semiconductor and EDA industries. Now in its third year, DVCon Taiwan 2026 continues its mission to bring together the local and international community to exchange ideas, explore the latest methodologies, and discuss emerging trends in design and … 
Join your colleagues in Monterey for the premier worldwide photomask conference We invite you to explore the latest advances and breakthroughs at this annual conference in Monterey, California. Connect with leading scientists and engineers and discover new work across photomasks, patterning, metrology, materials, inspection and repair, mask business, extreme ultraviolet lithography, and emerging technologies. Connect … Continue reading "SPIE Photomask Technology + Extreme Ultraviolet Lithography 2026"
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As the automotive industry transitions to software-defined vehicles, security must evolve from a collection of isolated protections into a trusted foundation for the entire vehicle. Over-the-air updates, centralized compute architectures, vehicle connectivity, and increasingly autonomous functions are placing unprecedented demands on automotive SoCs, while new regulations and long vehicle lifecycles raise the bar for security, … Continue reading "Webinar: Securing Software-Defined Vehicles with an Arm-Based Root of Trust" |
5 events,About the webinar Infineon is extending its XENSIV™ magnetic sensing portfolio with tunnel magnetoresistance (TMR)-based sensors designed to help engineers achieve high-precision, low-noise and low-power magnetic sensing in compact systems. In this webinar, we will give designers a crisp overview of the latest TMR product releases and explain how Infineon’s TMR technology can support position- and current-sensing …
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Online via Teams This discovery training introduces CODE V, a premium optical design software. CODE V enables engineers to design, analyze, and optimize optical systems such as camera lenses, telescopes, and photonics devices. It features advanced ray tracing, diffraction analysis, and powerful optimization engine. In addition, CODE V offers fast and accurate tolerancing, which helps …
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COMPANY EMAIL REQUIRED FOR REGISTRATION Full-chip SoC debug has become one of the most expensive bottlenecks in modern verification. A single production issue can pull multiple engineers away days as they chase a failure through waveforms, logs, and across hundreds of thousands of lines of code. In this webinar, we will demonstrate how the Bronco … Continue reading "Webinar: Cutting Full-Chip SoC Debug from Days to Minutes with AI" |
6 events,Join the second session of our three-part transmission simulation series to explore GPU-accelerated SPH water wading simulations using the ANSA SPH solver from Cadence. Learn how to evaluate pressure forces on vehicle components and couple SPH results with a structural solver to perform efficient one-way FSI analysis for automotive and other engineering applications. REGISTER HERE
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This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. Designing functionally correct, high-performance, and provably secure system-on-chips (SoCs) has become a strategic imperative for modern computing infrastructure. Yet traditional design and verification methodologies are increasingly strained by escalating complexity, massive design scales, heterogeneous integration, and … Continue reading "ESD Alliance Webinar: Gen-AI for Chip Design and Security"
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This webinar will present a multi-agent intelligent assistant system architected to automate and augment SoC design and security verification. Designing functionally correct, high-performance, and provably secure system-on-chips (SoCs) has become a strategic imperative for modern computing infrastructure. Yet traditional design and verification methodologies are increasingly strained by escalating complexity, massive design scales, heterogeneous integration, and … Continue reading "ESD Alliance Webinar: Gen-AI for Chip Design and Security"
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Learn how Ansys, part of Synopsys, and AWS enable engineering teams to deploy and scale simulation workloads in the cloud. Discover how cloud solutions such as Ansys Cloud Burst Compute deliver faster results, greater flexibility, and on-demand access to powerful compute resources. Overview Learn how Ansys, part of Synopsys, and AWS enable engineering teams to … |
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2 events,Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …
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Hosted in collaboration with Professor Slim Boumaiza, Director of the Centre for Intelligent Antenna and Radio Systems (CIARS) at the University of Waterloo. As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are navigating faster plays, tighter margins, and more complex signals than ever before. The challenge is no longer capturing … |
7 events,
What is the AI Infra Summit? The AI Infra Summit is the premier full-stack AI Infrastructure conference, arranged in a modular way that equally enables both enterprises and technology/solution providers to benefit from domain-specific content, all while doing business on the exhibition floor. Our 4 track event is divided into Hardware & Systems, Edge AI Infrastructure, Enterprise AI, …
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As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are navigating faster plays, tighter margins, and more complex signals than ever before. The challenge is no longer capturing signals, it is turning those measurements into meaningful insights that accelerate design and validation. Join Dr. Joel Dunsmore and fellow Keysight R&D experts …
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Featured Speakers: Madhumita Sanyal, Sr. Director of Technical Product Management, Synopsys Varun Agrawal, Director of Product Management, Synopsys As SoC complexity climbs, traditional verification can't keep pace — and system-level bugs surface late, when they're hardest to fix. By pairing Hardware-Assisted Verification (HAV) with Interface IP like PCIe, Ethernet, and DDR, teams validate earlier and … Continue reading "Webinar: Shift Left to Ship Faster: Verifying IP and SoCs at Real Workload Speeds"
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Earth observation systems and aerial drones share optical systems design workflow similarities – from telescope and imager architectures, stray-light control, and multi-spectral performance requirements for a variety of applications. In this webinar, we will share a few of these workflows and approach to those common threads through the optical system requirements and architecture development. We …
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MUST USE COMPANY EMAIL TO REGISTER A purpose-built multi-agent system for chip design shouldn't be a quarter-long project. On the Agentrys Studio Platform, the initial build takes about 30 minutes—plus however much customization your flow and data require. In this hands-on session, we'll build a working end-to-end Spec2GDS multi-agent system live using open-source EDA tools, … Continue reading "Webinar: Agents Assemble: Build Your Chip Design Multi-Agent System in 30 Minutes"
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AI ready data centers are reshaping cooling infrastructure, with the industry moving from traditional air cooling toward hybrid and liquid cooling architectures to support higher rack densities and stricter efficiency targets. Join this webinar to explore how simulation supports faster decisions, reduced risk, improved uptime, and future ready cooling infrastructure for high density AI compute … Continue reading "Webinar: Simulation for Data Center Cooling Infrastructure" |
5 events,
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Engineering teams are dealing with increasing system complexity, stricter integration requirements and the shift toward software-defined products. Generative AI is emerging as a valuable capability, but it is not sufficient on its own. To manage complexity and convergence across software and hardware, organizations need an integrated approach that connects people, processes and data. In this …
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*Work Email Required for Registration* For packaging, thermal, and mechanical engineers who need trusted warpage insight before stackup, material, and package architecture decisions are locked — and want to see what becomes possible when a full design study fits in an afternoon. In advanced packaging, warpage is rarely a modeling problem. It is a timing …
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Move Faster with Cadence Cloud, AI, and Modern Compute Join Cadence cloud experts and industry peers for EDA Cloud Tech Day, a focused session on how cloud, AI, and modern compute are helping semiconductor and system design teams move faster, scale more easily, and reduce infrastructure barriers. Learn how Cadence Cloud supports high-performance design and …
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Analog and custom design teams create many versions of schematics and layouts throughout the project life cycle as they optimize, verify, and refine their designs. Understanding exactly what changed between versions is critical, but it often depends on incomplete check-in comments, manual inspection, emails, or conversations between design and layout engineers. This webinar showcases Keysight Visual Design … |
8 events,
SEMICON India 2026 will be held from September 17–19, 2026, at Yashobhoomi (India International Convention & Expo Centre), New Delhi, bringing together the global semiconductor ecosystem on one powerful platform. Jointly organized by the India Semiconductor Mission (ISM) and SEMI, the event reflects India’s growing prominence as a trusted partner in the global semiconductor value chain. Under the visionary leadership of Hon’ble Prime … 
SEMICON India 2026 will be held from September 17–19, 2026, at Yashobhoomi (India International Convention & Expo Centre), New Delhi, bringing together the global semiconductor ecosystem on one powerful platform. Jointly organized by the India Semiconductor Mission (ISM) and SEMI, the event reflects India’s growing prominence as a trusted partner in the global semiconductor value chain. Under the visionary leadership of Hon’ble Prime … 
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements …
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About JEDEC JEDEC is the global leader in developing open standards for the microelectronics industry, with more than 3,000 volunteers representing over 380 member companies. JEDEC brings manufacturers and suppliers together to participate in more than 50 committees and subcommittees, with the mission to create standards to meet the diverse technical and developmental needs of …
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Skate Past Signal Complexity. Score Clearer Insights. As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are navigating faster plays, tighter margins, and more complex signals than ever before. The challenge is no longer capturing signals, it is turning those measurements into meaningful insights that accelerate design and validation. Join Dr. …
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Complex Signals. Clear Insights. As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are collecting more measurement data than ever before. The challenge is no longer capturing signals, it is turning those measurements into meaningful insights that accelerate design and validation. Join Dave Ballo and Keysight’s R&D experts for an interactive, … Continue reading "Advanced Measurements Seminar – Philadelphia"
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Featured Speakers: Igor Elkanovich, CTO, GUC Sheng-Fan Yang, Director, GUC Madhumita Sanyal, Sr. Director Product Management, Synopsys Co-packaged optics (CPO) breaks through the data movement constraint by moving optical engines next to the XPU, reducing electrical reach from centimeters to millimeters and delivering the bandwidth density and energy efficiency that copper can no longer provide. … Continue reading "Webinar: From Copper to COUPE: Scaling AI Interconnects with Co-Packaged Optics" |
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As RF systems continue to evolve with wider bandwidths and higher frequencies, engineers are navigating faster plays, tighter margins, and more complex signals than ever before. The challenge is no longer capturing signals, it is turning those measurements into meaningful insights that accelerate design and validation. Join Dr. Joel Dunsmore and fellow Keysight R&D experts … |
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2 events,Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's … 
“Grid Modernization: Enabling Large Loads, Advanced Storage, and Smart Technologies for a Secure and Resilient Energy Future” – HOST : Altalink WHAT TO EXPECT? The event in Calgary will undoubtedly be larger than previous CIGRE Canada events. The success of the International Symposium in Montreal will benefit development in terms of international delegates (e.g., from … Continue reading "CIGRE Energy Forum International Conference & Exhibition 2026" |
9 events,
About GTS Hosted across the globe, GTS is GlobalFoundries’ annual flagship event, where GF and industry leaders, technologists, customers and partners explore how disruptive technologies are shaping intelligent systems and the semiconductor industry as a whole. Each GTS event includes deep dives into the impact of GF’s differentiated solutions, results and innovations from our customers … Continue reading "GlobalFoundries Technology Summit 2026 China"
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements … 
Join us in Menlo Park! Join more than 150 semiconductor executives and professionals in Menlo Park, California, amid the stunning views of the Santa Cruz Mountains in Northern California. GSA’s U.S. Executive Forum will be held at the Rosewood Sand Hill, Menlo Park, in the Rosewood Ballroom. REGISTER HERE 
Register now: September 22nd, 2026 – 2 sessions available Session 1: September 22nd, 2026, 9 - 10 am CEST Session 2: September 22nd, 2026, 5 - 6 pm CEST Join our expert-led webinar for an in-depth look at Infineon’s comprehensive portfolio for solid-state transformers (SSTs). Discover how SST technology is enabling next-generation power distribution architectures for AI data centers, megawatt … Continue reading "Webinar: Solid-state transformers: accelerate your SST design"
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COMPANY EMAIL REQUIRED FOR REGISTRATION. Studies show that nearly 20% of the verification cycle is spent on assertion generation, debugging, and methodology integration — work that remains largely manual today or is delegated to general-purpose LLMs that hallucinate more than 30% of the time and produce incorrect assertions. WHAT WE WILL COVER Live demonstration of … Continue reading "Webinar: Avestra – Assertion Driven Silicon Success"
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About this event Start your next engineering breakthrough with a drink in hand and a driver in the bay. Join us for an after-hours tech social with Keysight experts, featuring a showcase of Keysight’s latest innovations, from HD3 oscilloscopes and signal generators to the latest handheld analyzers, advanced power solutions, and more. Then stick around … Continue reading "Drive & Derive: A Keysight x Electro Rent Tech Social"
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Overview Get ready to dive deep into the world of cutting-edge technology and innovation at the Silicon Photonics Workshop organized by Soitec! Soitec is thrilled to host an exclusive, private workshop running parallel to ECOC 2026. This year, we are diving straight into the infrastructure shaping tomorrow's tech landscape: Scaling Silicon Photonics from Foundry to AI Fabric … |
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Join Us to Connect, Collaborate, and Shape the Future of AI Get ready to immerse yourself in the future of semiconductor design at the 2026 TSMC Global Open Innovation Platform® (OIP) Ecosystem Forum! This isn’t just an event—it’s the ultimate collaborative hub where the world’s leading technology pioneers gather to discuss turning visionary ideas into reality. As … Continue reading "TSMC 2026 North America OIP Ecosystem Forum"
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It’s no secret that AI can transform engineering workflows. But are you getting the most out of your AI efforts? If you are struggling to leverage AI beyond scripting, this webinar is for you. Join us to learn how you can use AI, with confidence, to accelerate thermal engineering for space missions. Although design cycles … Continue reading "Webinar: How AI is Accelerating Thermal Engineering for Space Missions" |
6 events,
A Strategic Platform for Industry Leaders The Third Edition of the Global Photonics Economic Forum will convene September 24 - 25 in Malaga, Spain. Building on the success of the 2024 and 2025 edition this year the forum will focus on defining and sharing joint strategies to tackle the current volatile geopolitical landscape. Global photonics and semiconductor industries …
About GTS Hosted across the globe, GTS is GlobalFoundries’ annual flagship event, where GF and industry leaders, technologists, customers and partners explore how disruptive technologies are shaping intelligent systems and the semiconductor industry as a whole. Each GTS event includes deep dives into the impact of GF’s differentiated solutions, results and innovations from our customers … Continue reading "GlobalFoundries Technology Summit 2026 Taiwan"
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements …
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About This Event For the first time in North America, Keysight is bringing together its full Design Engineering Software portfolio in a single event. Discover how connected workflows across design, simulation, validation, software quality, optical design, and engineering data management help teams accelerate innovation, improve collaboration, and reduce development risk. Why You Should Attend Engineering …
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September 24, 2026 | 10:00 AM PDT 6G standardization is accelerating: 3GPP RAN1 is actively evaluating candidate waveforms, new duplexing schemes, and advanced channel coding proposals, with each organization running proprietary simulators under subtly different assumptions. This makes direct comparison of results nearly impossible, and the gap between academic simulation and production-ready design continues to … Continue reading "Webinar: From Waveforms to AI: Simulating 6G Before It Exists (America’s Session)" |
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On behalf of the organizing committee, it is my great honor and pleasure to welcome you to Yokohama, Japan, for the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026), September 27－October 2, 2026. The ICSCRM conference series is the premier international forum focusing on all aspects of silicon carbide and related materials. … |
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The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging … |
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About Shaping the future of AI The AI Conference was founded on a clear belief: AI is not a standalone technology—it is becoming the foundation of modern software, infrastructure, and business. Since launching in 2023, the conference has focused relentlessly on applied AI: how AI systems are actually built, deployed, governed, and scaled in the real world. Why What …
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements … 
Where the Microelectronics Ecosystem Converges Semiconductors • Photonics • Embedded Systems Connecting the entire value chain — from R&D to manufacturing, packaging, testing and deployment. Microelectronics UK brings together engineers, technical leaders and technology providers from across the microelectronics ecosystem — spanning semiconductors, photonics and embedded systems — for two days of technical insight, collaboration and commercial … |
5 events,
Teradyne Users Group TUGx Global Seminars are a series of complimentary, one-day events hosted in key locations around the world. These seminars are designed to bring together local engineering communities and provide a platform for knowledge sharing and collaboration. By hosting these events globally, Teradyne ensures that customers everywhere have access to the latest advancements … |
4 events,
3DIC 2026 will cover all 3D system integration topics including 3D/2.5D process technology, interposers, and chiplets, materials, equipment, circuit technology, design methodology, and applications. Attendees will interact with researchers from all around the world. REGISTER HERE |
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