Webinar: EMX Planar 3D Solver – Key New Features and Updates

The increasing complexity of chip designs that leverage 3D-IC technology, heterogeneous integration, and other manufacturing advancements, emphasizes the need for accurate modeling of electromagnetic (EM) crosstalk. EM solvers continue to play a key role in solving larger problems both in terms of layout size and number of ports.

The latest release of the EMX Planar 3D Solver offers increased engine capacity to enable it to address design complexity of a higher order. In this webinar you will learn about the key new features in this latest release, including:

• Net-based meshing that allows the user to select any net and mesh it differently
• White-boxing that enables certain simulation ports to be terminated with networks, thereby reducing the overall number of EM ports that go to the EMX solver
• Enhanced handling of metal fill that smartly approximates the effect of small, lower metal layer fill, thus significantly reducing simulation times and computing resource requirements