Webinar: Advanced Packaging and Material Characterization for Microelectronics: SEMI Training

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package.