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WP_Term Object
(
    [term_id] => 31
    [name] => GlobalFoundries
    [slug] => globalfoundries
    [term_group] => 0
    [term_taxonomy_id] => 31
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 243
    [filter] => raw
    [cat_ID] => 31
    [category_count] => 243
    [category_description] => 
    [cat_name] => GlobalFoundries
    [category_nicename] => globalfoundries
    [category_parent] => 158
    [is_post] => 
)

Collaboration at 28nm, 20nm and 14nm

Collaboration at 28nm, 20nm and 14nm
by Daniel Payne on 06-06-2012 at 11:23 am


Wednesday morning I attended a panel discussion with: ARM, IBM, Cadence, GLOBALFOUNDRIES and Samsung.

The panelists all sang the same song of collaboration between EDA, IP and Foundry to enable 28nm, 20nm and even 14nm.… Read More


Understanding and Designing For Variation in GLOBALFOUNDRIES 28nm

Understanding and Designing For Variation in GLOBALFOUNDRIES 28nm
by Daniel Nenni on 06-03-2012 at 8:30 pm

On Wednesday there is a User Track Poster Session that examines the design impact of process variation in GLOBALFOUNDRIES 28nm technology. For those of you who are wondering what process variation looks like at 20nm take this 28nm example and multiply it by one hundred (slight exaggeration, maybe).

Variation effects have a significant… Read More


Beyond 28nm: New Frontiers and Innovations in Design For Manufacturability at the Limits of the Scaling Roadmap

Beyond 28nm: New Frontiers and Innovations in Design For Manufacturability at the Limits of the Scaling Roadmap
by Daniel Nenni on 05-22-2012 at 9:00 pm

The introduction of 28nm high-volume production for IC semiconductor devices will usher the era of “extreme low-k1” manufacturing, i.e. the unprecedented situation in the long history of the silicon technology roadmap, where computationally intensive (and EDA-driven) Design-Technology Co-Optimization will become the… Read More


Semiconductor Ecosystem Keynotes: ARM 2012

Semiconductor Ecosystem Keynotes: ARM 2012
by Daniel Nenni on 05-17-2012 at 5:00 pm

Yesterday’s SEMICO IP Ecosystem Conference was well worth the time. Everybody was there: ARM, Synopsys, Cadence, Mentor Graphics, GlobalFoundries, TSMC, MIPS, Tensilica, AMD, Atrenta, Sonics, and Tabula, everybody except Intel of course. What do Intel and I have in common? We don’t play well with others…

First up was… Read More


GlobalFoundries 2012 Update!

GlobalFoundries 2012 Update!
by Daniel Nenni on 05-04-2012 at 8:55 pm

What’s new with Glofo? Quite a bit actually. It was interesting to see a Made in America: Global Companies Expand in U.S. Towns segment on semiconductors! Give it a look, I enjoyed it. It’s an election year, jobs are key to any election, so it did not surprise me to see President Obama making the rounds:… Read More


GLOBALFOUNDRIES Dresden Fab 1

GLOBALFOUNDRIES Dresden Fab 1
by Daniel Nenni on 03-18-2012 at 6:00 pm

Even though my Dresden trip was fraught with fail points it went off without a hitch. Flying over was easy, I connected through London Heathrow, flying back I connected through Frankfurt. The last time I connected through Frankfurt was right after the 9/11 attacks so I had a bit of deja vu. I was in Munich, Heathrow was closed, I was … Read More


Common Platform: Onward to the Future

Common Platform: Onward to the Future
by Paul McLellan on 03-14-2012 at 3:03 pm

There were keynotes from all three semiconductor partners in the Common Platform Alliance and, as if to show how common they are, they all talked about the problems that need to be addressed in the next decade and a half and they all said pretty much the same thing. Gary Patton of IBM went first and so he got to say everything first. Plus,… Read More


Common Platform Technology Forum: Peering into the Future

Common Platform Technology Forum: Peering into the Future
by Paul McLellan on 03-10-2012 at 9:00 am

Next Wednesday is the Common Platform Technology Forum. “Common Platform” is a name that only a committee could have come up with, giving no clue as to what it actually is. As you probably know, there are various process clubs sharing the costs of technology development (TD) and one of them consists of IBM, Samsung and… Read More