WP_Term Object
(
    [term_id] => 23277
    [name] => Sarcina Technology
    [slug] => sarcina-technology
    [term_group] => 0
    [term_taxonomy_id] => 23277
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 5
    [filter] => raw
    [cat_ID] => 23277
    [category_count] => 5
    [category_description] => 
    [cat_name] => Sarcina Technology
    [category_nicename] => sarcina-technology
    [category_parent] => 386
    [is_post] => 
)
            
Sarcina SemiWiki Banner 030824
WP_Term Object
(
    [term_id] => 23277
    [name] => Sarcina Technology
    [slug] => sarcina-technology
    [term_group] => 0
    [term_taxonomy_id] => 23277
    [taxonomy] => category
    [description] => 
    [parent] => 386
    [count] => 5
    [filter] => raw
    [cat_ID] => 23277
    [category_count] => 5
    [category_description] => 
    [cat_name] => Sarcina Technology
    [category_nicename] => sarcina-technology
    [category_parent] => 386
    [is_post] => 
)

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers
by Mike Gianfagna on 10-24-2024 at 6:00 am

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More


How Sarcina Revolutionizes Advanced Packaging #61DAC

How Sarcina Revolutionizes Advanced Packaging #61DAC
by Mike Gianfagna on 07-17-2024 at 10:00 am

DAC Roundup – How Sarcina Revolutionizes Advanced Packaging

#61DAC was buzzing with discussion of chiplet-based, heterogeneous design.  This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More


Sarcina Teams with Keysight to Deliver Advanced Packages

Sarcina Teams with Keysight to Deliver Advanced Packages
by Mike Gianfagna on 05-23-2024 at 10:00 am

Sarcina Teams with Keysight to Deliver Advanced Packages

All aspects of semiconductor design and manufacturing require collaboration across a global ecosystem. As complexity increases, so does the importance of good collaboration. This is especially true for advanced package design. Thanks to the movement to multi-die design, package development has become an incredibly difficult… Read More


How Sarcina Technology Makes Advanced Semiconductor Package Design Easier

How Sarcina Technology Makes Advanced Semiconductor Package Design Easier
by Mike Gianfagna on 03-11-2024 at 6:00 am

How Sarcina Technology Makes Advanced Semiconductor Package Design Easier

For a long time, package engineering was part of the cleanup crew for chip design. The glory was all around the design of advance monolithic chips on the latest technology node. Once the design was done, the package/test team would take the design over the finish line, adding the required I/O specs, lead frame, load board and test … Read More


CEO Interview: Larry Zu of Sarcina Technology

CEO Interview: Larry Zu of Sarcina Technology
by Daniel Nenni on 03-01-2024 at 6:00 am

Larry Zu Photo 091516

Larry has grown Sarcina from designing semiconductor packages for a few small companies, to doing package designs for top semiconductor companies around the world. From 2014 to 2018, Larry led the expansion of Sarcina beyond package design into final test and wafer sort hardware and software development.

Larry is a semiconductor… Read More