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Key Takeaways from the webinar:
Multi-agent intelligent assistant systems of the future will be architected to automate and augment SoC design and security verification and redefining semiconductor innovation, reshaping design, verification and security for the next generation of trusted silicon.
The ESD Alliance is delighted… Read More
Daniel is joined by Ed Nelson, Strategy Director and Co-Founder of AI Infra Summit. He co-leads the production team and specializes in product strategy and management, keynote speaker acquisition and VIP network development. Ed started the summit in 2018 and has spent nearly ten years as part of the team building AI Infra Summit… Read More
At #DAC2026 I met with Vamshi Kothur at Tuple Technologies to see how their cloud infrastructure products help IC design teams get their chip designs to market more quickly without the overhead of big IT and CAD teams. Tuple was founded in 2017 and has grown to about 45 people, headquartered in New Jersey. The challenge of using complex… Read More
Brendan Emery is Co-Founder and Chief Executive Officer of iQ Sense Technology. He has more than 25 years of international experience in animal health, having held senior commercial leadership roles with organisations including Boehringer Ingelheim and Norbrook Laboratories.
Together with Co-Founder and CTO Madhu Jambunathan,… Read More
The semiconductor industry is entering an extraordinary growth phase, driven primarily by artificial intelligence infrastructure and the severe supply constraints surrounding advanced logic and memory devices. According to the McClean Report’s June 2026 update, the global semiconductor market is forecast to grow 98.3%… Read More
AI was a hot topic at DAC this year. If you attended the event, you’ve already heard about many new tools and systems that aim to improve time to market and quality for advanced semiconductors and systems. I had the pleasure of chairing an Accellera sponsored luncheon panel on Tuesday at DAC that took a different view of AI.
As AI and … Read More
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
Global unit shipments of PCs and smartphones were both down versus a year ago in the 2nd quarter of 2026, according to IDC. PCs were down 4.9% and smartphones were down 6.7%. Both PCs and smartphones showed growth in 2024 and 2025. IDC is predicting an 11.3% decline in PCs and a 13.9% decline in smartphones in 2026.
What is causing the… Read More
As architects push toward advanced nodes and increasingly demanding workloads, modern silicon design has entered an era of unprecedented complexity. A single design respin can cost millions of dollars and delay market entry. Against this backdrop, designs must be balanced for performance, bandwidth, power efficiency, security… Read More
Tuple Technologies develops AI-powered infrastructure and operations platforms specifically designed for semiconductor companies. The company’s solutions help engineering organizations simplify CAD infrastructure management, optimize cloud resources, improve security and compliance, and reduce operational… Read More
Why ASML Is Racing to Build 110 EUV Machines