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PCI-SIG DevCon and Where Samtec Fits

PCI-SIG DevCon and Where Samtec Fits
by Mike Gianfagna on 06-07-2023 at 6:00 am

PCI SIG DevCon and Where Samtec Fits

PCIe (peripheral component interconnect express) is an interface standard for connecting high-speed components contained in PCs, MACs and other types of processors. Think graphics, storage arrays, Wi-Fi and the like. This communication standard has become incredibly popular. The first version of the standard was released… Read More


TSMC Clarified CAPEX and Revenue for 2023!

TSMC Clarified CAPEX and Revenue for 2023!
by Daniel Nenni on 06-06-2023 at 2:00 pm

TSMC HQ Taiwan

TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B.  Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More


WEBINAR: UCIe PHY Modeling and Simulation with XMODEL

WEBINAR: UCIe PHY Modeling and Simulation with XMODEL
by Daniel Nenni on 06-05-2023 at 6:00 am

UCIe image2

Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More


WEBINAR: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive

WEBINAR: Driving Forward with UWB Radar: Enhancing Child Safety in Automotive
by Daniel Nenni on 06-01-2023 at 6:00 am

CEVA UWB Radar Webinar Email Invitation 230521

 

The rapid advancement of UWB (Ultra-Wideband) wireless technology has garnered significant attention and interest, thanks to its adoption by leading smartphone brands and its versatile range of applications. Within the automotive industry, UWB has already emerged as the preferred choice for Digital Keys in the premium… Read More


WEBINAR: An Ideal Neural Processing Engine for Always-sensing Deployments

WEBINAR: An Ideal Neural Processing Engine for Always-sensing Deployments
by Daniel Nenni on 05-29-2023 at 10:00 am

Option 1

Always-sensing cameras are a relatively new method for users to interact with their smartphones, home appliances, and other consumer devices. Like always-listening audio-based Siri and Alexa, always-sensing cameras enable a seamless, more natural user experience. However, always-sensing camera subsystems require specialized… Read More


AMAT- Trailing Edge & China Almost Offset Floundering Foundry & Missing Memory

AMAT- Trailing Edge & China Almost Offset Floundering Foundry & Missing Memory
by Robert Maire on 05-22-2023 at 8:00 am

Amat China

-AMAT reported inline resulted helped by trailing edge & China
-Memory remains at very low levels- Foundry remains uninspiring
-China seems to be buying anything they are allowed to buy
-The recovery is too far out & unknown to handicap

Quarter was OK and Guidance also OK

Revenue was $6.63B and EPS of $1.86 versus reduced… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


SPIE 2023 – imec Preparing for High-NA EUV

SPIE 2023 – imec Preparing for High-NA EUV
by Scotten Jones on 05-17-2023 at 6:00 am

Figure 1 Pellicle Transmission

The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.

I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More


Join the AI Generated Open-Source Silicon Design Challenge!

Join the AI Generated Open-Source Silicon Design Challenge!
by Daniel Nenni on 05-16-2023 at 10:00 am

Join the AI Generated Open Source Silicon

As we all know design starts are the life blood of the semiconductor industry, both big and small. Enabling those design starts is what the semiconductor ecosystem is all about and Efabless has a very unique value proposition in this regard.

Efabless is a free cloud-based chip design platform, growing community of 9000+ chip designers,… Read More


Emerging Stronger from the Downturn

Emerging Stronger from the Downturn
by Kalar Rajendiran on 05-16-2023 at 6:00 am

Full Flow from HL Synthesis through to GDSII Accelerates the creation of AI IP

It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More