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WP_Term Object
(
[term_id] => 50
[name] => Events
[slug] => events
[term_group] => 0
[term_taxonomy_id] => 50
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 1382
[filter] => raw
[cat_ID] => 50
[category_count] => 1382
[category_description] =>
[cat_name] => Events
[category_nicename] => events
[category_parent] => 0
[is_post] =>
)
-Strength in trailing tools offsets weak memory resulting in flat
-Order book very volatile but backlog surprisingly still grew
-Trailing edge VS Leading edge = 50/50 – Foundry/logic over 2/3
-Not nearly as bad as Lam but not as good as ASML
AMAT posts good quarter & guide – Flat for three quarters
Applied Materials… Read More
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More
The first chiplets focused summit took place last month. So many accomplished speakers gave keynote talks on what direction should and would the Chiplets ecosystem evolution take. Corigine presented the keynote on what direction hardware emulation should and would evolve for speeding up chiplet- based designs. During a pre-conference… Read More
PCI Express Power Bottleneck
Madhumita Sanyal, Sr. Technical Product Manager, and Gary Ruggles, Sr. Product Manager, discussed the tradeoffs between power and latency in PCIe/CXL data centers during a live SemiWiki webinar on January 26, 2023. The demands on PCIe continue to grow with the integration of multiple components… Read More
The first annual Chiplet Summit was held last week in San Jose and I must say it exceeded my expectations, but I have some advice for the participating speakers and sponsoring companies. A good portion of the content was on WHY chiplets and not HOW. I think we have progressed passed this point and if we keep dwelling on it we will delay… Read More
-Lam Research chops guidance, outlook & headcount sharply
-Further declines as 2023 will be H1 weighted- No end in sight
-System sales cut by more than half as even service is cut
-Memory is the culprit as expected-Forcing business “reset”
A sad sounding conference call….
While Lam reported a good December,… Read More
-Demand far exceeds supply & much longer than any downturn
-Full speed ahead-$40B in solid backlog provides great comfort
-ASP increase shows strength- China is non issue
-In a completely different league than other equipment makers
Reports a good beat & Guide
Revenues were Euro6.4B with system sales making up Euro4.7B… Read More
A comprehensive report from the US Department of Energy (DOE), “Semiconductor Supply Chain Deep Dive Assessment” (February 2022) calls for a 1000X energy efficiency improvement that is required to maintain future compute requirement needs given a finite amount of world energy production. Energy efficiency is at the top of … Read More
Many technical shows have anchor tenants. Those are the companies that can be counted on to have a substantial booth presence, be active in the technical program and just pump life into the event at every turn. Samtec is that company for many shows around the world. And soon it will be time for them to work their magic at DesignCon in … Read More
Ten years ago the Open Mobile Video Coalition was touting its plans to deliver free over-the-air television to mobile devices and automobiles. At the time, OMVC was seen as the realization of a dream of delivering video to cars – front seat and back.
The dream didn’t last long and the plans for ATSC M/H brought to the market by the OMVC… Read More
TSMC N3 Process Technology Wiki