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At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.
With… Read More
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.
I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More
As we all know design starts are the life blood of the semiconductor industry, both big and small. Enabling those design starts is what the semiconductor ecosystem is all about and Efabless has a very unique value proposition in this regard.
Efabless is a free cloud-based chip design platform, growing community of 9000+ chip designers,… Read More
It was refreshing to hear a talk focused on emerging stronger from the downturn when the news and media are focused on the gloom. At the recent Siemens EDA User2User conference, Joe Sawicki, executive vice president, IC, gave an uplifting keynote talk to the audience. He highlighted a secular growth trend happening in the semiconductor… Read More
Spring wouldn’t be the same without an opportunity to hear from some of the most visible executives of electronic system design (ESD) market segment. The in-person CEO Outlook sponsored by Keysight and hosted by the ESD Alliance, a SEMI Technology Community, will be held Thursday, May 18, in Santa Clara, Calif.
Attendees can expect… Read More
As I sift through mounds of semiconductor press releases trying to figure out the relevance (with mixed results) I consider it a learning experience even when they don’t really tell me anything. This one however tells me two very important things:
1) Arm is a much more competitive company with the new leadership. I saw a noticeable… Read More
At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was the very personable Dr. Henry Sheng, Group Director of R&D in the EDA Group at Synopsys. Henry currently leads engineering for 3DIC, advanced technology and visualization.
There were quite a few announcements at the TSMC Technical Symposium last week but the most important, in my opinion, were based on TSMC N3 tape-outs. Not only is N3 the leading 3nm process it is the only one in mass production which is why all of the top tier semiconductor companies are using it. TSMC N3 will be the most successful node… Read More
I’ve been following Solido as a start-up EDA vendor since 2005, then they were acquired by Siemens in 2017. At the recent User2User event there was a presentation by Kwonchil Kang, of Samsung Electronics on the topic, ML-enabled Statistical Circuit Verification Methodology using Solido. For high reliability circuits… Read More
Anirudh is an engaging speaker with a passion for technology. Acknowledging the sign of the times, he sees significant value-add in AI but reminded us that it is a still supporting actor in system design and other applications where star roles will continue to be played by computational software that’s founded in hard science, … Read More
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