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Synopsys RedHawk sc webinar 800x100px
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Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026

Synopsys Explores AI/ML Impact on Mask Synthesis at SPIE 2026
by Mike Gianfagna on 03-16-2026 at 6:00 am

Synopsys Explores AI:ML Impact on Mask Synthesis at SPIE 2026

The SPIE Advanced Lithography + Patterning Symposium recently concluded. This is a popular event where leading researchers gather. Challenges such as optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications are all covered. This… Read More


Agentic AI and the Future of Engineering

Agentic AI and the Future of Engineering
by Daniel Nenni on 03-13-2026 at 6:00 am

sassine announces agentic ai hires converge 2026

Agentic AI emerges in this Synopsys Converge keynote not as a futuristic add-on, but as a practical response to the growing complexity of engineering. In the speaker’s view, the traditional way of designing chips, systems, and intelligent products is no longer sufficient for the era of physical AI. Engineers are now dealing with… Read More


Ravi Subramanian on Trends that are Shaping AI at Synopsys

Ravi Subramanian on Trends that are Shaping AI at Synopsys
by Daniel Nenni on 03-12-2026 at 8:00 am

Ravi Interview Synopsys Converge

Right before the Synopsys Converge Keynote I caught an interview with Ravi Subramanian, Chief Product Management Officer at Synopsys, which highlights several important trends shaping the future of AI, semiconductor technology, and engineering. His discussion focuses on how the worlds of silicon design and system engineering… Read More


Efficient Bump and TSV Planning for Multi-Die Chip Designs

Efficient Bump and TSV Planning for Multi-Die Chip Designs
by Daniel Nenni on 03-10-2026 at 6:00 am

Efficient Bump and TSV Planning for Multi Die Chip Designs

The semiconductor industry has experienced rapid advancements in recent years, particularly with the increasing demand for high-performance computing, artificial intelligence, and advanced automotive systems. Traditional single-die chip designs are often unable to meet modern PPA requirements. As a result, engineers… Read More


Reducing Risk Early: Multi-Die Design Feasibility Exploration

Reducing Risk Early: Multi-Die Design Feasibility Exploration
by Kalar Rajendiran on 03-05-2026 at 10:00 am

Feasibility Thermal Map

The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More


Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems

Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems
by Kalar Rajendiran on 03-03-2026 at 10:00 am

UCIe bump planning in 3DIC Compiler Platform

The first article in this series examined how feasibility exploration enables architects to evaluate multi-die system configurations while minimizing early design risk. Once architectural decisions are validated, designers must translate conceptual connectivity requirements into physical interconnect infrastructure.… Read More


How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI

How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI
by Kalar Rajendiran on 02-26-2026 at 10:00 am

chip design for blog

As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More


Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
by Daniel Nenni on 02-25-2026 at 8:00 am

1 abhijeet chakraborty chiplet summit keynote 2026

At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More


Hardware is the Center of the Universe (Again)

Hardware is the Center of the Universe (Again)
by Lauro Rizzatti on 02-23-2026 at 10:00 am

Hardware is the Center of the Universe (Again) Figure 1

The 40-Year Evolution of Hardware-Assisted Verification — From In-Circuit Emulation to AI-Era Full-Stack Validation

For more than a decade, Hardware-Assisted Verification platforms have been the centerpiece of the verification toolbox. Today, no serious semiconductor program reaches tapeout without emulation or FPGA-prototyping… Read More


Smarter IC Layout Parasitic Analysis

Smarter IC Layout Parasitic Analysis
by Daniel Payne on 02-18-2026 at 10:00 am

ParagonX flow

IC layout parasitics dominate the performance of custom digital, analog and mixed-signal designs, so the challenge becomes how to identify the root causes and to quantify the effects of parasitics during early design stages. The old method of iterating between layout, extraction, SPICE simulation, followed by manual debug… Read More