Paul, Raúl and I are having fun with our Innovation in Verification series, and you seem to be also, judging by the hit rates we’re getting. We track these carefully to judge what you find most interesting and what seems to fall more under the category of “Meh”. Paul and others also get informal feedback in client meetings but it would… Read More
Electronic Design Automation
DAC 2021 Wrap-up – S2C turns more than a few heads
Now that the 58th Design Automation Conference held this year in San Francisco has concluded, we take a minute to look back at the results and ascertain what it meant for our company.
Unfortunately, many popular tradeshows held in the time of Covid have suffered a drop in attendance, and DAC was no exception. Despite this however,… Read More
Is Ansys Reviving the Collaborative Business Model in EDA?
The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More
Top 10 Takeaways from DAC 2021
The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco. (As several presenters were unable to attend, a “virtual” program is also available.) The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms; new features in commercial EDA tools; … Read More
DAC 2021 – Joe Sawicki explains Digitalization
Monday at DAC this year started off on a very optimistic note as Joe Sawicki from Siemens EDA presented in the Pavilion on the topic of Digitalization, a frequent theme in the popular press because of the whole Work From Home transition that we’ve gone through during the pandemic. Several industries are benefiting from the… Read More
A Practical Approach to Better Thermal Analysis for Chip and Package
Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory Controller… Read More
Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development. Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More
Effectively Managing Large IP Portfolios For Complex SoC Projects
In today’s world, no IC design is completed without instantiating a few or many pre-verified or already proven intellectual property (IP) blocks. With break-neck pace at which chip designs are advancing, many IP blocks may even be entire chip designs from earlier product releases. Third-party IP market has been growing at a healthy… Read More
Live 58th Design Automation Conference Coverage!
My beautiful first mate and I will be together at DAC this year. Her first DAC was 1985 in Las Vegas and we lived happily ever after. SemiWiki bloggers Tom Dillinger and Daniel Payne will also be at DAC attending sessions and meeting with exhibiting companies to learn and blog about the latest innovations inside the semiconductor … Read More
A Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development
Every now and then, disruptive technology is brought to market, challenging the way things have been done to that point. We are all familiar with many such technologies. The rhetorical question is, how many of us were aware, recognized and acknowledged those technologies before they became well established? For example, a startup… Read More
Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing