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Mentor SemiWiki Banner
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Formal and High-Level Synthesis

Formal and High-Level Synthesis
by Bernard Murphy on 01-22-2020 at 6:00 am

SLEC verification

Formal verification has made significant inroads in RTL and gate-level verification because it provides complementary strengths to conventional dynamic verification methods; using both provides higher levels of coverage and confidence in the correctness of an implementation. I haven’t heard as much about formal use in … Read More


Saving Time in Physical Verification by Reusing Metadata

Saving Time in Physical Verification by Reusing Metadata
by Daniel Payne on 01-08-2020 at 10:00 am

voltage propagation cross reference data min

Physical verification is an important and necessary step in the process to tapeout an IC design, and the foundries define sign-off qualification steps for:

  • Physical validation
  • Circuit validation
  • Reliability verification

This sounds quite reasonable until you actually go through the steps only to discover that some of the … Read More


PAVE360 is Fully Armed!

PAVE360 is Fully Armed!
by Daniel Nenni on 01-06-2020 at 12:00 pm

PAve360 and Arm IP accelerates innovation

Siemens today announced a partnership with Arm to “accelerate the future of mobility by redefining design capabilities for complex electronic systems”. I spent time with David Fritz to understand what this really means. You may remember David from our webinar PAVE360: Of SoCs, Digital Twins, and Validating Autonomous VehicleRead More


Full Solution for eMRAM Coming in 2020

Full Solution for eMRAM Coming in 2020
by Tom Simon on 12-19-2019 at 6:00 am

Trimming for eMRAM in Tessent

It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More


A VIP to Accelerate Verification for Hyperscalar Caching

A VIP to Accelerate Verification for Hyperscalar Caching
by Bernard Murphy on 12-18-2019 at 6:00 am

NVMe

Non-volatile memory (NVM) is finding new roles in datacenters, not currently so much in “cold storage” as a replacement for hard disk drives, but definitely in “warm storage”. Warm storage applications target an increasing number of functions requiring access to databases with much lower latency than is possible through paths… Read More


The First Must-Have in 5G

The First Must-Have in 5G
by Bernard Murphy on 12-11-2019 at 6:00 am

Bulk acoustic wave filter

If I was asked about must-have needs for 5G, I’d probably talk about massive MIMO and a lot of exotic parallel DSP processing, also perhaps need for new intelligent approaches to link adaptation and intelligent network slicing in the infrastructure. But there’s something that comes before that all that digital cleverness, in … Read More


Webinar Recap: Challenges of Autonomous Vehicle Validation

Webinar Recap: Challenges of Autonomous Vehicle Validation
by Daniel Payne on 11-27-2019 at 10:00 am

Waymo Jaguar

Autonomous vehicle progress is in the daily news, so it’s quite exciting to watch it develop with the help of SoC design, sensors, actuators and software from engineering teams spanning the entire globe. Tesla vehicles have reached Level 2 autonomy, Audi e-tron is at Level 3, and Waymo nearly at Level 5 with robot taxis being… Read More


MEMS Actuation and the Art of Prototyping

MEMS Actuation and the Art of Prototyping
by Bernard Murphy on 11-27-2019 at 5:00 am

Thermal actuator prototyping

I mentioned a while back that I’m really getting into the role that sensors play in our new hyper-connected world – in the IoT, intelligent cars, homes, cities, industry, utilities, medicine, agriculture, etc, etc. If we can think of a way to sense it and connect it, someone is probably already doing it. But there’s more to … Read More


Mentor unpacks LVS and LVL issues around advanced packaging

Mentor unpacks LVS and LVL issues around advanced packaging
by Tom Simon on 11-26-2019 at 6:00 am

Innovations in packaging have played an important role in improving system performance and area utilization. Advances like 2.5D interposers and fan-out wafer-level packaging (FOWLP) have allowed mixed dies to be used in a single package and have dramatically reduced the number of connections that need to go all the way to the… Read More


ITC shines light on new Mentor Test announcements

ITC shines light on new Mentor Test announcements
by Tom Simon on 11-18-2019 at 10:00 am

The 50th International Test Conference was just held in Washington DC, where papers, sessions, workshops and announcements addressing the increasing complexity and expanding use of semiconductors showed that innovations in test are crucial to design and product success. Test methodologies and even the scope of test have … Read More