Artificial intelligence (AI) is driving a transformation in data center infrastructure, necessitating cutting-edge technologies to meet the growing demands of AI workloads. As AI systems scale up and out, next-gen compute servers, switches, optical-electrical links, and flexible, redundant networking solutions are … Read More
Artificial Intelligence
Navigating Frontier Technology Trends in 2024
Many of you are already familiar with Silicon Catalyst and the value it brings to semiconductor startups, the industry and the electronics industry at large. Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and… Read More
Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More
Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More
Is AI-Based RTL Generation Ready for Prime Time?
In semiconductor design there has been much fascination around the idea of using large language models (LLMs) for RTL generation; CoPilot provides one example. Based on a Google Scholar scan, a little over 100 papers were published in 2023, jumping to 310 papers in 2024. This is not surprising. If it works, automating design creation… Read More
Sondrel Redefines the AI Chip Design Process
Designing custom silicon for AI applications is a particularly vexing problem. These chips process enormous amounts of data with a complex architecture that typically contains a diverse complement of heterogeneous processors, memory systems and various IO strategies. Each of the many subsystems in this class of chip will … Read More
Elevating AI with Cutting-Edge HBM4 Technology
Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
Safety Grading in DNNs. Innovation in Verification
How do you measure safety for a DNN? There is no obvious way to screen for a subset of safety-critical nodes in the systolic array at the heart of DNNs. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas.… Read More
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the Curtain
Even for experienced technologists some technologies can seem almost indistinguishable from magic. One example is the bird’s eye camera view available on your car’s infotainment screen. This view appears to be taken from a camera hovering tens of feet above your car. As an aid to parallel parking, it’s a brilliant invention; … Read More
CES 2025: All In on AI and Proposed Tariffs