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Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


Is AI-Based RTL Generation Ready for Prime Time?

Is AI-Based RTL Generation Ready for Prime Time?
by Bernard Murphy on 10-02-2024 at 6:00 am

shutterstock 2495413145 min

In semiconductor design there has been much fascination around the idea of using large language models (LLMs) for RTL generation; CoPilot provides one example. Based on a Google Scholar scan, a little over 100 papers were published in 2023, jumping to 310 papers in 2024. This is not surprising. If it works, automating design creation… Read More


Sondrel Redefines the AI Chip Design Process

Sondrel Redefines the AI Chip Design Process
by Mike Gianfagna on 10-01-2024 at 6:00 am

Sondrel Redefines the AI Chip Design Process

Designing custom silicon for AI applications is a particularly vexing problem. These chips process enormous amounts of data with a complex architecture that typically contains a diverse complement of heterogeneous processors, memory systems and various IO strategies. Each of the many subsystems in this class of chip will … Read More


Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Safety Grading in DNNs. Innovation in Verification

Safety Grading in DNNs. Innovation in Verification
by Bernard Murphy on 09-25-2024 at 6:00 am

Innovation New

How do you measure safety for a DNN? There is no obvious way to screen for a subset of safety-critical nodes in the systolic array at the heart of DNNs. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas.… Read More


Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More


Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the Curtain

Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the Curtain
by Bernard Murphy on 09-18-2024 at 6:00 am

car 5 copy small

Even for experienced technologists some technologies can seem almost indistinguishable from magic. One example is the bird’s eye camera view available on your car’s infotainment screen. This view appears to be taken from a camera hovering tens of feet above your car. As an aid to parallel parking, it’s a brilliant invention; … Read More


Serving their AI Masters

Serving their AI Masters
by Claus Aasholm on 09-17-2024 at 10:00 am

Semiconductor AI Supply Chain 2024

The Impact of the AI Revolution on the Server Manufacturers

While some will designate my research as market research, I view it differently. Having done and bought plenty of market sizing research, I have not seen it lead to any change in behaviour or strategy. It has been used to confirm a strategy already decided and the “great” … Read More


TetraMem Integrates Energy-Efficient In-Memory Computing with Andes RISC-V Vector Processor

TetraMem Integrates Energy-Efficient In-Memory Computing with Andes RISC-V Vector Processor
by Wenbo Yin on 09-10-2024 at 10:00 am

MX100

The rapid proliferation of artificial intelligence (AI) across a growing number of hardware applications has driven an unprecedented demand for specialized compute acceleration not met by conventional von Neumann architectures. Among the competing alternatives, one showing the greatest promise is analog in-memory computing… Read More