Banner Electrical Verification The invisible bottleneck in IC design updated 1
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CEO Interview with Wilfred Gomes of Mueon Corporation

CEO Interview with Wilfred Gomes of Mueon Corporation
by Daniel Nenni on 10-27-2025 at 2:00 pm

wilfred gomes

Wilfred Gomes is the co-founder, CEO, and president of Mueon Corporation, a next-generation infrastructure startup rethinking how data centers are built for the AI era. The company’s flagship innovation, Cubelets™, modular, stackable units that unite compute, memory, power delivery and thermal management, replace the … Read More


Pioneering Edge AI: TekStart’s Cognitum Processor Ushers in a New Era of Efficient Intelligence

Pioneering Edge AI: TekStart’s Cognitum Processor Ushers in a New Era of Efficient Intelligence
by Daniel Nenni on 10-27-2025 at 10:00 am

2510.1 Semiwiki Image 1

One of the more in interesting companies I met at the AI Infra Summit was a company known to me for some time. The most interesting part was the chip they are in the process of taping out; It is a high-performance, ultra-low-power AI processor purpose-built for edge computing. It is claimed to deliver “the processing muscle … Read More


A Tour of Advanced Data Conversion with Alphacore

A Tour of Advanced Data Conversion with Alphacore
by Mike Gianfagna on 10-27-2025 at 6:00 am

A Tour of Advanced Data Conversion with Alphacore

There is always a lot of buzz about advanced AI workloads at trade shows. How to train them and how to run them. Advanced chip and multi-die designs are how AI is brought to life, so it was a perfect fit for discussion at a show. But there is another side of this discussion. Much of the work going on in AI workloads has to do with processing… Read More


Chiplets: Powering the Next Generation of AI Systems

Chiplets: Powering the Next Generation of AI Systems
by Kalar Rajendiran on 10-23-2025 at 10:00 am

Arm Synopsys at Chiplet Summit

AI’s rapid expansion is reshaping semiconductor design. The compute and I/O needs of modern AI workloads have outgrown what traditional SoC scaling can deliver. As monolithic dies approach reticle limits, yields drop and costs rise, while analog and I/O circuits gain little from moving to advanced process nodes. To sustain … Read More


Better Automatic Generation of Documentation from RTL Code

Better Automatic Generation of Documentation from RTL Code
by Tom Anderson on 10-23-2025 at 6:00 am

Specador Doc

One technical topic I always find intriguing is the availability of links between documentation and chip design. It used to be simple: there weren’t any. Architects wrote a specification (spec) in text, in Word if they had PCs, or using “troff” or a similar format if they were limited to Unix platforms. Then the hardware designers… Read More


Learning from In-House Datasets

Learning from In-House Datasets
by Bernard Murphy on 10-22-2025 at 6:00 am

Training in a Constrained Environment min

At a DAC Accellera panel this year there was some discussion on cross-company collaboration in training. The theory is that more collaboration would mean a larger training set and therefore higher accuracy in GenAI (for example in RTL generation). But semiconductor companies are very protective of their data and reports of copyrighted… Read More


PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West

PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West
by Mike Gianfagna on 10-21-2025 at 6:00 am

PDF Solutions Calls for a Revolution in Semiconductor Collaboration at SEMICON West

SEMICON West was held in Phoenix, Arizona on October 7-9. This premier event brings the incredibly diverse global electronics supply chain together to address the semiconductor ecosystem’s greatest opportunities and challenges. The event’s tagline this year is:

Stronger Together — Shaping a Sustainable Future in Talent,Read More


The AI PC: A New Category Poised to Reignite the PC Market

The AI PC: A New Category Poised to Reignite the PC Market
by Jonah McLeod on 10-20-2025 at 10:00 am

Fig 1

The PC industry is entering its most significant transformation since the debut of the IBM PC in 1981. That original beige box ushered in a new era of productivity, reshaping how corporations and individuals worked, communicated, and created. More than four decades later, the AI PC is emerging as a new category — one that promises… Read More


Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co-Packaged Copper and Optics
by Mike Gianfagna on 10-17-2025 at 6:00 am

Webinar – The Path to Smaller, Denser, and Faster with CPX, Samtec’s Co Packaged Copper and Optics

For markets such as data center, high-performance computing, networking and AI accelerators the battle cry is often “copper is dead”. The tremendous demands for performance and power efficiency often lead to this conclusion. As is the case with many technology topics, things are not always the way they seem. It turns out a lot … Read More


Webinar – IP Design Considerations for Real-Time Edge AI Systems

Webinar – IP Design Considerations for Real-Time Edge AI Systems
by Mike Gianfagna on 10-16-2025 at 10:00 am

Webinar – IP Design Considerations for Real Time Edge AI Systems

It is well-known that semiconductor growth is driven by AI. That simple statement breaks down into many complex use cases, each with its own requirements and challenges. A webinar will be presented by Synopsys on October 23 that focuses on the specific requirements for one of the most popular use cases – AI at the edge. The speaker… Read More