Large design enterprises have multiple concurrent activities around IP of various types: software/firmware, blocks defined in RTL or HLS, verification IPs of multiple different types, physical implementations, scripts/files for timing, power management, etc., etc. Each of these continues to evolve and branch to serve … Read More
Artificial Intelligence
The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI Boom
Most crypto forty-niners died broke in a warehouse full of their computing rigs. Former Ethereum miner CoreWeave took its gold to Wall Street. On June 22, 2026, it joined the Nasdaq-100 — fifteen months after its IPO, nine years after its founders assembled their first GPU rig in a New Jersey office.
The people who built the physical… Read More
WEBINAR: Defacto is Boosting Front-end SoC Design With AI-Powered EDA tools
The real promise of AI in EDA is not to replace EDA tools or reinvent design flows, it is to help engineers accomplish existing tasks even more complex design tasks faster, more safely, and with far less tool expertise than was previously required.
The webinar explores what a truly effective AI-powered EDA tool should look like, … Read More
Webinar: Caspia Shows You How to Fix Security Flaws Before It’s Too Late
Chip-level vulnerability is becoming an existential threat for virtually all systems. The time to ensure your chip designs are resistant to these attacks is now. Caspia presented a webinar recently that provides important information on how to build attack-resistant chips. If you missed it, don’t worry. A replay link is coming.… Read More
Why Real-Time Intelligence is the Next Differentiator in Semiconductor Test
Even with advances in AI, automation, and advanced process technology, many semiconductor test operations still rely on reports generated hours after production has occurred. This creates a significant and growing problem. By the time engineers discover a yield excursion, parametric drift, tester issue, or an increase in… Read More
Why Huawei Says It Will Match TSMC’s Most Advanced Chips by 2031
Huawei’s assertion that it could match TSMC in producing the world’s most advanced chips by 2031 reflects both technological ambition and geopolitical necessity. As one of China’s leading technology companies, Huawei has faced significant restrictions on access to advanced semiconductor technology due to U.S. export controls.… Read More
Applying QED to Hardware Accelerator Verification. Innovation in Verification
QED (Quick Error Detection) can be a powerful complementary addition to verification but can be subject to size constraints. This month’s paper looks at a fix for that limitation. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More
From Tokens to Infrastructure: Why Compute, Memory, and Power Will Determine the Future of AI
Based on Dylan Patel’s SEMI Industry Strategy Symposium (ISS): Tokens to Infrastructure presentation, one of the most important themes is the emergence of the AI Economic Stack, where every layer of artificial intelligence—from semiconductor manufacturing to cloud infrastructure, model providers, and applications—is… Read More
How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.
llmda.ai… Read More
COMPUTEX 2026: S2C and Andes Technology Showcase Hardcore “EDA+IP” Synergy for the AI Era
COMPUTEX 2026 officially concluded under the theme “AI Together,” bringing the global semiconductor and computing ecosystem together to showcase the latest advances in artificial intelligence, HPC, and intelligent systems. While AI accelerators and advanced computing platforms dominated the exhibition floor, one collaboration… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging