Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
Collaboration Required to Maximize ASIC Chiplet Value
It is a well-known fact that chiplets provide several advantages over traditional monolithic chips. Despite these benefits, the transition to a chiplet-based design paradigm presents challenges that need coordinated efforts across the industry. In essence, collaborative efforts among various players involved are not … Read More
Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More
Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More
Bug Hunting in NoCs. Innovation in Verification
Despite NoCs being finely tuned in legacy subsystems, when subsystems are connected in larger designs or even across multi-die structures, differing traffic policies and system-level delays between NoCs can introduce new opportunities for deadlocks, livelocks and other hazards. Paul Cunningham (GM, Verification at Cadence),… Read More
Alphawave Semi Unlocks 1.2 TBps Connectivity for HPC and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
In the rapidly evolving fields of high-performance computing (HPC) and artificial intelligence (AI), reducing time to market is crucial for maintaining competitive advantage. HBM3E systems play a pivotal role in this regard, particularly for hyperscaler and data center infrastructure customers. Alphawave Semi’s… Read More
Why Glass Substrates?
The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More
Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration
In a DACtv session on July 22, 2024, Rich Goldman from Ansys discussed the partnership with NVIDIA, focusing on accelerating engineering simulations and visualizing 3D IC designs in Omniverse. The collaboration, outlined in six pillars defined by NVIDIA CEO Jensen Huang, leverages NVIDIA’s GPUs and Grace CPUs to enhance… Read More
TSMC Foundry 2.0 and Intel IDM 2.0
When Intel entered the foundry business with IDM 2.0 I was impressed. Yes, Intel had tried the foundry business before but this time they changed the face of the company with IDM 2.0 and went “all-in” so to speak. The progress has been impressive and today I think Intel is well positioned to capture the NOT TSMC business by providing… Read More
How Sarcina Revolutionizes Advanced Packaging #61DAC
#61DAC was buzzing with discussion of chiplet-based, heterogeneous design. This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More
EUV Resist Degradation with Outgassing at Higher Doses