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As analog and mixed-signal designs become increasingly complex, parasitic effects dominate both design time and cost, consuming 30–50% of engineers’ effort in debugging and reanalyzing circuits. Addressing these multiphysics effects requires early verification strategies and reliable simulation solutions. Modern … Read More
It is hard to believe this conference is older than most all of the participants, including myself. The amount of history behind this conference is amazing. Back in 1955 the meeting began as the Electron Devices Meeting (EDM), organized by what later became the IEEE Electron Devices Society. Its core purpose was to bring together… Read More
As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
AI, hyperscale data centers, and data-intensive workloads are driving unprecedented demands for performance, bandwidth, and energy efficiency. As the economic returns of traditional transistor scaling diminish, advanced IC packaging and heterogeneous integration have become the primary levers for system-level scaling.… Read More
I have written earlier in this series that quantum error correction (QEC), a concept parallel to ECC in classical computing, is a gating factor for production quantum computing (QC). Errors in QC accumulate much faster than in classical systems, requiring QEC methods that can fix errors fast enough to permit production applications.… Read More
Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
Daniel is joined by John Maculley, Global High-Tech Industry Strategy Consultant at Dassault Systèmes. John has over 20 years of experience advancing innovation across the semiconductor and electronics sectors. Based in Silicon Valley, he works with leading foundries, OSATs, design houses, and research institutes worldwide… Read More
Daniel is joined by John Ferguson, senior director of product management for the Calibre products in the 3DIC space at Siemens EDA. He manages the vision and product offerings in the Calibre domain for 3DIC design solutions.
Dan explores the challenges of 3DIC and chiplet-based design with John, who describes the broad range of… Read More
There’s more than one way to build a quantum computer (QC) though it took me a while to find a good reference. I finally settled on Building Quantum Computers: A Practical Introduction. Excellent book but designed only for those who will enjoy lots of quantum math. I’m going to spare you that and instead describe a couple of the more… Read More
By Dina Medhat
Three key takeaways
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TSMC Process Simplification for Advanced Nodes