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Co-packaged optics is usually described as a proximity problem.
Move the optical engine closer to the switch ASIC or XPU. Shorten the electrical path. Reduce SerDes power. Increase bandwidth density.
That direction is real.
Optical functionality is moving progressively closer to compute.
But proximity does not eliminate … Read More
TSMC reportedly plans to double its Chip-on-Wafer-on-Substrate capacity from approximately 130,000 300mm-equivalent wafers per month at the end of 2026 to 260,000 by 2028. The estimate is not formal company guidance and should be treated as a supply-chain projection. Nevertheless, the direction is consistent with TSMC’s… Read More
By Joel Jorgensen, FlowAccel.
The 2026 Siemens EDA and Wilson Research Group study just came out. Verification now eats close to half the schedule on every IC and FPGA program. I don’t doubt that number. What I don’t know is how much of it is actually verification, and how much of it is something else showing up disguised… Read More
It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran, will join me in covering the event live, so stay tuned for all the news that’s fit to print.
Mike and… Read More
Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory, input/output… Read More
Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More
TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More
Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one, then connect … Read More
Temperature is often treated as a reliability clock.
Increase the temperature, accelerate the failure mechanism, and estimate the equivalent field life.
That approach can be useful—but only when the dominant failure mechanism is known, its thermal activation behavior is understood, and the same mechanism remains active … Read More
I had a chance sit down with James Huang, Director of Engineering at Alchip Technologies, to discuss the company’s recent multi-die packaging achievements and learn about Alchip’s next steps in pushing the boundaries of innovation for next generation AI ASIC.
James is acknowledged as a leading light in advanced node ASICs, based… Read More
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ASML Has High-NA and Chipmakers Can’t Say No