Events EDA2025 esig 2024 800X100
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Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters

Synopsys-Ansys 2.5D/3D Multi-Die Design Update: Learning from the Early Adopters
by Daniel Nenni on 11-06-2024 at 10:00 am

banner for webinar

The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More


Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers
by Mike Gianfagna on 10-24-2024 at 6:00 am

Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers

2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More


Analog Bits Builds a Road to the Future at TSMC OIP

Analog Bits Builds a Road to the Future at TSMC OIP
by Mike Gianfagna on 10-21-2024 at 6:00 am

Analog Bits Builds a Road to the Future at TSMC OIP

The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More


Navigating Resistance Extraction for the Unconventional Shapes of Modern IC Designs

Navigating Resistance Extraction for the Unconventional Shapes of Modern IC Designs
by Nada Tarek on 10-15-2024 at 6:00 am

Fig1 MEMS design

The semiconductor industry is experiencing rapid evolution, driven by the proliferation of IoT applications, image sensors, photonics, MEMS applications, 3DIC and other emerging technologies. This growth has dramatically increased the complexity of integrated circuit (IC) design. One aspect of this complexity is the … Read More


Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024

Maximizing 3DIC Design Productivity with 3DBlox: A Look at TSMC’s Progress and Innovations in 2024
by Kalar Rajendiran on 10-08-2024 at 10:00 am

3DFabric Silicon Validated Thermal Analysis

At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More


Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design

Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design
by Kalar Rajendiran on 10-02-2024 at 10:00 am

OIP 2024 Synopsys TSMC

Synopsys made significant announcements during the recent TSMC OIP Ecosystem Forum, showcasing a range of cutting-edge solutions designed to address the growing complexities in semiconductor design. With a strong emphasis on enabling next-generation chip architectures, Synopsys introduced both new technologies and … Read More


5 Expectations for the Memory Markets in 2025

5 Expectations for the Memory Markets in 2025
by Daniel Nenni on 10-01-2024 at 10:00 am

Expectations for the Memory Markets in 2025

TechInsights has a new memory report that is worth a look. It is free if you are a registered member which I am. HBM is of great interest and there is a section on emerging and embedded memories for chip designers. Even though I am more of a logic person, memory is an important part of the semiconductor industry. In fact, logic and memory

Read More

Elevating AI with Cutting-Edge HBM4 Technology

Elevating AI with Cutting-Edge HBM4 Technology
by Kalar Rajendiran on 09-30-2024 at 10:00 am

HBM4 Compute Chiplet Subsystem

Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More


Collaboration Required to Maximize ASIC Chiplet Value

Collaboration Required to Maximize ASIC Chiplet Value
by Kalar Rajendiran on 09-24-2024 at 10:00 am

Chiplet Alchip

It is a well-known fact that chiplets provide several advantages over traditional monolithic chips. Despite these benefits, the transition to a chiplet-based design paradigm presents challenges that need coordinated efforts across the industry. In essence, collaborative efforts among various players involved are not … Read More


Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More