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Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary:
Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More
One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More
The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.
And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.
This … Read More
I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More
As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More
Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More
The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More
About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.
AI is creating two related… Read More
At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More
Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More
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The silent killer of analog reliability: Why SPICE misses floating net