Juan Rey is Head of Technology and Innovation for Electronic Design Automation (EDA) at Siemens and Vice President and General Manager for Calibre. He joined Mentor Graphics, now Siemens EDA, in 2001 and led engineering, research, development, and quality for Calibre before retiring in late 2021. He returned to the company a … Read More
CPO’s Next Challenge: Turning Optical Performance into Manufacturable Systems
Why integration boundaries, assembly strategies, and manufacturing yield must be engineered together
The Shift from Optical Performance to Manufacturing Scale
Co-packaged optics (CPO) is moving beyond laboratory demonstrations toward commercial deployment in AI infrastructure. As switch bandwidth continues to increase,… Read More
Three-Dimensional Chess Anyone? The Challenges of Power Integrity for Multi-Die Designs
Power integrity has been a substantial design challenge for a long time. In the multi-die era, the problems associated with EMIR analysis must now move beyond the chip to consider interactions across the entire stack. The effects to be analyzed span a multi-dimensional, multi-material space. The graphic at the top of this post… Read More
Glass Is Becoming an AI Infrastructure Platform
The value of glass will be determined not by its material properties alone, but by whether it can expand the package architecture window and be realized repeatedly at manufacturing scale.
AI infrastructure is pushing advanced packaging into a regime where the substrate itself increasingly determines what can be built.
As packages… Read More
The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival
The philosophy of relying on a single, unified IP stack to lower your total cost of ownership is not a new concept invented just for the AI era. Semiconductor engineering teams have been weighing the trade-offs of piecemeal versus integrated intellectual property sourcing for decades. In previous process generations, veering… Read More
Reimagining 3D IC Design: From Architecture to Signoff
By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA
The semiconductor industry is undergoing a fundamental transformation. Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a powerful alternative… Read More
Agentic AI accelerates 3D IC engineering for the AI factory era
By Sudarshan Deo, software R&D Manager for 3D IC, Siemens
What if you could completely rethink what an EDA workflow looks like for the increasingly complex 3D ICs powering the next generation of AI factories? Siemens’ expanded agentic AI portfolio is automating the hardest parts of 3D IC engineering.
At NVIDIA GTC Berlin 2026,… Read More
Intel’s Tiny Bridges Could Lead to Very Big Paychecks
Intel’s next big opportunity could come from something that sounds spectacularly unglamorous: connecting tiny pieces of silicon. Advanced packaging rarely attracts the attention lavished on powerful processors or artificial intelligence models. Yet it increasingly determines how effectively those technologies perform.… Read More
Inside the Package Powering Modern AI
TSMC’s CoWoS-S is critical to the artificial intelligence era because it solves the central systems problem facing modern accelerators: computing capability is growing faster than conventional packages can supply data, power, and connectivity. CoWoS-S, meaning Chip-on-Wafer-on-Substrate with a silicon interposer, … Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More


Jensen Huang and the Cost of Unchecked Influence