The recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More
Author: Mike Gianfagna
Analog Bits Continues to Dominate Mixed Signal IP at the TSMC Technology Symposium
WEBINAR: Navigating the Power Challenges of Datacenter Infrastructure
We all know power and energy management is a top-of-mind item for many, if not all new system designs. Optimizing system power is a vexing problem. Success requires coordination of many hardware and software activities. The strategies to harmonize operation for high performance and low power are often not obvious. Much… Read More
Ceva Accelerates IoT and Smart Edge AI with a New Wireless Platform IP Family
Ceva is a very focused company. In its words, the leader in innovative silicon and software IP solutions that enable smart edge products to connect, sense, and infer data more reliably and efficiently. You can see some of its accomplishments here. The company has been licensing IP for more than twenty years with more than 17 billion… Read More
Design Stage Verification Gives a Boost for IP Designers
The concept of shift left is getting to be quite well-known. The strategy involves integrating various checks typically performed later in the design process into earlier stages. The main benefit is to catch and correct defects or errors at an earlier stage when it’s easier and faster to address. For complex SoC design, … Read More
How Secure-IC is Making the Cyber World a Safer Place
Securing the data and all the associated transactions that comprise our hyper-connected world is a daunting task. Security touches the hardware, software and all the channels connecting every device and every transaction. Threats can be embedded in software, hardware or systems can be compromised externally using a large … Read More
Soitec Delivers the Foundation for Next-Generation Interconnects
Soitec is a unique company that is at the center of major changes in our industry. Technology megatrends are fueling massive demand for semiconductors and this has increased the adoption of engineered substrates. As a global leader in the development of engineered substrates, Soitec is a company to watch. While this technology… Read More
Semidynamics Shakes Up Embedded World 2024 with All-In-One AI IP to Power Nextgen AI Chips
Semidynamics takes a non-traditional approach to design enablement. Not long ago, the company’s Founder and CEO, Roger Espasa unveiled extreme customization at the RISC-V Summit. That announcement focused on a RISC-V Tensor Unit designed for ultra-fast AI solutions. Recently, at Embedded World 2024 the company took this … Read More
Intel is Bringing AI Everywhere
On April 8 and 9 Intel held its Intel Vision event in Phoenix Arizona. This is Intel’s premier event for business and technology executive leaders to come together and learn about the latest industry trends and solutions in advancements from client, to edge, to data center and cloud. The theme of this year’s event was Bringing AI … Read More
sureCore Brings 16nm FinFET to Mainstream Use With a New Memory Compiler
Semiconductor processes can have a rather long and interesting life cycle. At first, a new process defines the leading edge. This is cost-no-object territory, where performance is king. The process is new, the equipment to make it is expensive, and its use is reserved for those that have a market (and budget) big enough to justify… Read More
yieldHUB Improves Semiconductor Product Quality for All
We all know that building advanced semiconductors is a team sport. Many design parameters and processes must come together in a predictable, accurate and well-orchestrated way to achieve success. The players are diverse and cover the globe. Assembling all the information required to optimize the project in one place, with the… Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing