Ceva recently unveiled its XC21 and XC23 DSP cores, designed to revolutionize wireless communications and edge AI processing. These new offerings build upon the Ceva-XC20 architecture, delivering unmatched efficiency, scalability, and performance for 5G-Advanced, pre-6G, and smart edge applications. As demand grows … Read More
Author: Kalar Rajendiran
Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
Cut Defects, Not Yield: Outlier Detection with ML Precision
How much perfectly good silicon is being discarded in the quest for reliability? During high-volume chip manufacturing, aggressive testing with strict thresholds may ensure quality but reduces yield, discarding marginal chips that could function flawlessly. On the other hand, prioritizing yield risks allowing defective… Read More
Cutting Through the Fog: Hype versus Reality in Emerging Technologies
Silicon Catalyst is an organization that supports early-stage semiconductor startups with an ecosystem that provides tools and resources needed to design, create, and market semiconductor solutions. It is the only incubator + accelerator focused on the Global Semiconductor Industry and operates with the motto “It’s about… Read More
Powering the Future: How Engineered Substrates and Material Innovation Drive the Semiconductor Revolution
Engineered substrate technology is driving an evolution within the semiconductor industry. As Moore’s Law reaches its limits, the focus is shifting from traditional planar wafer scaling to innovative material engineering and 3D integration. Companies like Soitec, Intel and Samsung are pioneering this transition, unlocking… Read More
Synopsys Expands Hardware-Assisted Verification Portfolio to Address Growing Chip Complexity
Last week, Synopsys announced an expansion of their Hardware-Assisted Verification (HAV) portfolio to accelerate semiconductor design innovations. These advancements are designed to meet the increasing demands of semiconductor complexity, enabling faster and more efficient verification across software and hardware… Read More
Soitec: Materializing Future Innovations in Semiconductors
The semiconductor industry continues to evolve rapidly to meet the escalating demands for speed, power efficiency, and miniaturization. As traditional silicon-based technologies reach their physical and performance limits, engineered substrates and advanced material innovation have emerged as pivotal drivers of the… Read More
Embracing the Chiplet Journey: The Shift to Chiplet-Based Architectures
The semiconductor industry is facing a paradigm shift. Traditional scaling, once driven by Moore’s Law, is slowing down. For years, moving to smaller process nodes led to lower transistor costs and better performance. However, scaling from node to node now offers fewer benefits as wafer costs rise much more than the historical… Read More
Chiplets-Based Systems: Keysight’s Role in Design, Testing, and Data Management
Keysight, with deep roots tracing back to Hewlett-Packard, has long been at the forefront of innovation in electronic design and testing. It manufactures electronics test and measurement equipment and software. The company also owns its own foundry and makes custom chips and packages for its instrumentation business. Many… Read More
Will 50% of New High Performance Computing (HPC) Chip Designs be Multi-Die in 2025?
Predictions in technology adoption often hinge on a delicate balance between technical feasibility and market dynamics. While business considerations play a pivotal role, the technical category reasons for the success or failure of a prediction are more tangible and often easier to identify—if scrutinized with care. However,… Read More
Accelerating FPGA-Based SoC Prototyping
FPGA-based prototyping offers advantages such as high-speed operation, real-world environment testing, and parallel execution that cannot be matched by software simulations alone. It enables developers to validate their designs and initiate software development long before the final silicon is ready. At the same time,… Read More
Rethinking Multipatterning for 2nm Node