Checklist to Ensure Silicon Interposers Don’t Kill Your Design

Checklist to Ensure Silicon Interposers Don’t Kill Your Design
by Dr. Lang Lin on 03-20-2023 at 10:00 am

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Traditional methods of chip design and packaging are running out of steam to fulfill growing demands for lower power, faster data rates, and higher integration density. Designers across many industries – like 5G, AI/ML, autonomous vehicles, and high-performance computing – are striving to adopt 3D semiconductor… Read More