Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs

Multiphysics, Multivariate Analysis: An Imperative for Today’s 3D-IC Designs
by Daniel Nenni on 06-26-2022 at 6:00 am

Ansys Heat Map

Semiconductor manufacturers are under constantly increasing and intense pressure to accelerate innovative new chip designs to market faster than ever in smaller package sizes while assuring signal integrity and reducing power consumption. Three-dimensional integrated circuits (3D-ICs) promise to answer all these demands… Read More


Three Key Takeaways from the 2022 TSMC Technical Symposium!

Three Key Takeaways from the 2022 TSMC Technical Symposium!
by Daniel Nenni on 06-16-2022 at 12:10 pm

TSMC Technology Roadmap 2022

The TSMC Technical Symposium is today so I wanted to give you a brief summary of what was presented. Tom Dillinger will do a more technical review as he has done in the past. I don’t want to steal his thunder but here is what I think are the key takeaways. First a brief history lesson.

The history of TSMC Technology Development with 12 keyRead More


WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network

WEBINAR: 5G is moving to a new and Open Platform O-RAN or Open Radio Access Network
by Daniel Nenni on 06-10-2022 at 6:00 am

The demands of 5G requires new designs to not only save power but also increase performance and by moving to advance power-saving nodes and by using eFPGAs will help to achieve these goals. This paper will introduce 5G and O-RAN, the complexity of these systems, and how flexibility could be beneficial. Then we will dive into how eFPGA… Read More


The New Normal for Semiconductor Manufacturing

The New Normal for Semiconductor Manufacturing
by Daniel Nenni on 05-27-2022 at 6:00 am

200mm 300mm Semiconductor Capacity

One of the recent live events I attended was the 2022 GSA Silicon Leadership Summit on May 12th at the Santa Clara Convention Center (my favorite location). This was the first GSA live event in two years so it was a must attend gathering. This event targets semiconductor ecosystem executives (200+ people attended) so there were many… Read More


Take a Leap of Certainty at DAC 2022

Take a Leap of Certainty at DAC 2022
by Daniel Nenni on 05-22-2022 at 6:00 am

Ansys DAC 2022

The live events I have attended thus far this year have been very good. As much as I liked the virtual events, attending in the comfort of my home or sailboat, it is great to be live and networking inside the semiconductor ecosystem, absolutely.

Ansys has been a great supporter of the Design Automation Conference but this year they … Read More


CEO Interview: Vaysh Kewada of Salience Labs

CEO Interview: Vaysh Kewada of Salience Labs
by Daniel Nenni on 05-20-2022 at 6:00 am

Salience Vaysh Kewada

Vaysh Kewada is cofounder and CEO at Salience Labs, a company developing an ultra high-speed multi-chip processor that packages a photonics chip together with standard electronics to enable exascale AI. Salience is funded by Oxford Sciences Enterprise, Cambridge Innovation Capital, Arm-backed Deeptech Labs, former Dialog… Read More


TSMC N3 will be a Record Setting Node!

TSMC N3 will be a Record Setting Node!
by Daniel Nenni on 05-19-2022 at 6:00 am

waferr007 2518 Q9Wf 0

With the TSMC Technical Symposium coming next month there is quite a bit of excitement inside the fabless semiconductor ecosystem. Not only will TSMC give an update on N3, we should also hear details of the upcoming N2 process.

Hopefully TSMC will again share the number of tape-outs confirmed for their latest process node. Given… Read More


224G Serial Links are Next

224G Serial Links are Next
by Daniel Nenni on 05-17-2022 at 6:00 am

link designs

The tremendous increase in global data traffic over the past decade shows no sign of abating.  Indeed, the applications for all facets of data communications are expanding, from 5G (and soon, 6G) wireless communications to metropolitan area networks serving autonomous vehicles to broader deployment of machine learning algorithms. … Read More


CEO Interview: Chuck Gershman of Owl AI

CEO Interview: Chuck Gershman of Owl AI
by Daniel Nenni on 05-13-2022 at 6:00 am

Corp with Backdrop

Chuck Gershman CEO is the co-founder Owl Autonomous Imaging, Inc. Chuck is a Drexel University College of Engineering inductee into the Alumni Circle of Distinction, the highest honor bestowed upon alumni. He has been honored as a finalist for CMP publications (EE Times) prestigious ACE award as High Technology Executive of… Read More


Semiconductor Crash Update

Semiconductor Crash Update
by Daniel Nenni on 05-12-2022 at 10:00 am

Semiconductors are Capturing Electronics

Earlier this year semiconductor oracle Malcom Penn did his 2022 forecast which I covered here: Are We Headed for a Semiconductor Crash? The big difference with this update is the black economic clouds that are looming which may again highlight Malcolm’s forecasting prowess. I spent an hour with Malcolm and company on his Zoom cast… Read More