You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More
Dr. Wei has served as CEO & CTO of Easy-Logic since 2020. Prior to this role, Dr. Wei served as CTO since 2014 where he constructed the core algorithm and the tool structure of EasyECO. As the CEO, Dr. Wei focuses on building a strong company infrastructure. In his CTO role he interfaces with strategic ASIC design customers … Read More
TSMC clarified CAPEX and revenue for 2023 last night at the Annual Shareholders Meeting. Last year TSMC guided up during this meeting but this year they guided down. CAPEX was guided down to the lower end of $36B-$32B. Revenue was guided down from low-single to mid-single digit so maybe down another percent or two. The TSMC Jan… Read More
Join this webinar and see UCIe in action! This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital FSMs in the logical layer. The whole physical layer (PHY) model can be efficiently simulated in SystemVerilog,… Read More
The rapid advancement of UWB (Ultra-Wideband) wireless technology has garnered significant attention and interest, thanks to its adoption by leading smartphone brands and its versatile range of applications. Within the automotive industry, UWB has already emerged as the preferred choice for Digital Keys in the premium… Read More
In 2020 TSMC established its Net Zero Project with a goal of net zero emissions by 2050. I remember wondering how could this possibly be done before 2050 or at all for that matter. After working with TSMC for 20+ years I have learned never to bet against them on any topic and green manufacturing is one of them, absolutely.
TSMC presented… Read More
Always-sensing cameras are a relatively new method for users to interact with their smartphones, home appliances, and other consumer devices. Like always-listening audio-based Siri and Alexa, always-sensing cameras enable a seamless, more natural user experience. However, always-sensing camera subsystems require specialized… Read More
Issam Nofal is the CEO of IROC Technologies and has held various positions with the company for over 23 years as Product Manager, Project Leader, and R&D Engineer. He has authored several papers on test and reliability of Integrated Circuits. He holds a PhD in Microelectronics from Grenoble INP.
What is IROC Technologies’
…
Read More
AI-generated chip design is progressing at an incredible pace!
Earlier this week, I wrote about the Efabless AI Generated Open–Source Silicon Design Challenge. If you haven’t done so already, take a closer look at the challenge and see first-hand what this is all about. In talking to Mike Wishart and Mohamed Kassem, co-founders… Read More
According to UK based The Telegraph Pulsic is a chip maker and Cadence is a swooping US giant. I guess you have to stretch the truth to get those precious clicks these days. Even so this is a strategic acquisition for Cadence.
Pulsic is a 20+ year old EDA software company that offers chip planning and implementation software for custom… Read More
Rapidus, IBM, and the Billion-Dollar Silicon Sovereignty Bet