TSMC 2023 North America Technology Symposium Overview Part 3

TSMC 2023 North America Technology Symposium Overview Part 3
by Daniel Nenni on 04-27-2023 at 6:00 am

3DFabric Technology Portfolio

TSMC’s 3DFabric initiative was a big focus at the symposium, as it should be. I remember when TSMC first went public with CoWos the semiconductor ecosystem, including yours truly, let out a collective sigh wondering why TSMC is venturing into the comparatively low margin world of packaging. Now we know why and it is  absolutely… Read More


TSMC 2023 North America Technology Symposium Overview Part 2

TSMC 2023 North America Technology Symposium Overview Part 2
by Daniel Nenni on 04-26-2023 at 8:00 pm

TSMC N3 Update 2023

The next topic I would like to cover is an update to the TSMC process node roadmap starting with N3. As predicted, N3 will be the most successful node in the TSMC FinFET family. The first version of N3 went into production at the end of last year (Apple) and will roll out with other customers in 2023. There is a reported record amount of … Read More


TSMC 2023 North America Technology Symposium Overview Part 1

TSMC 2023 North America Technology Symposium Overview Part 1
by Daniel Nenni on 04-26-2023 at 6:00 pm

Advanced Technology Roadmap

The TSMC 2023 North America Technology Symposium happened today so I wanted to start writing about it as there is a lot to cover. I will do summaries and other bloggers will do more in-depth coverage on the technology side in the coming weeks. Having worked in the fabless semiconductor ecosystem the majority of my 40 year semiconductor… Read More


S2C Helps Client to Achieve High-Performance Secure GPU Chip Verification

S2C Helps Client to Achieve High-Performance Secure GPU Chip Verification
by Daniel Nenni on 04-20-2023 at 6:00 am

S2C Prototyping 2023

S2C, a leading provider of FPGA-based prototyping solutions, has helped a client achieve high-performance secure GPU chip verification. With the help of S2C’s Prodigy prototyping solution, the client was able to start software development and hardware-software co-design early, leading to accelerated time-to-market… Read More


Multi-Die Systems: The Biggest Disruption in Computing for Years

Multi-Die Systems: The Biggest Disruption in Computing for Years
by Daniel Nenni on 04-14-2023 at 6:00 am

SNUG Panel 1

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. The discussion was based on a report published by the MIT Technology Review Insights in cooperation with Synopsys. This is a very comprehensive report (12 pages) that is available online HERE.

Here is the prefaceRead More


Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization

Taking the Risk out of Developing Your Own RISC-V Processor with Fast, Architecture-Driven, PPA Optimization
by Daniel Nenni on 04-12-2023 at 10:00 am

Updated Speaker Slide

Are you developing or thinking about developing your own RISC-V processor? You’re not alone. The use of the RISC-V ISA to develop processors for SoCs is a growing trend. RISC-V offers a lot of flexibility with the ability to customize or create ISA and microarchitectural extensions to differentiate your design no matter your application… Read More


LIVE WEBINAR – The ROI of User Experience Design: Increase Sales and Minimize Costs

LIVE WEBINAR – The ROI of User Experience Design: Increase Sales and Minimize Costs
by Daniel Nenni on 04-11-2023 at 10:00 am

planorama webinar blog graphic sm

The semiconductor industry has seen a significant shift towards vertical integration of products, expanding from chips to generalized or purpose-built integrated solutions. As software becomes an increasingly critical component of these solutions, leveraging modern software development processes with User ExperienceRead More


WEBINAR: Design Cost Reduction – How to track and predict server resources for complex chip design project?

WEBINAR: Design Cost Reduction – How to track and predict server resources for complex chip design project?
by Daniel Nenni on 04-11-2023 at 6:00 am

picture innova

During the design of complex chips, cost reduction is becoming a real challenge for small, medium and large companies.  Resource management is a key to contain design cost.

The chip design market is expecting automated solutions to help in the resource prediction, planning and analysis. AI-based technologies are promising … Read More


LIVE WEBINAR: New Standards for Semiconductor Materials

LIVE WEBINAR: New Standards for Semiconductor Materials
by Daniel Nenni on 04-05-2023 at 6:00 am

New Standards for Semiconductor Materials

This is the 5th webinar in our series of webinars to explore trending topics on materials and semiconductor development. Join us to discover how digital solutions are forming new ways of operating in a fast-paced, highly demanding semiconductor industry.

With data analytics and digital tools, we are setting new standards for

Read More

Chiplets, is now their time?

Chiplets, is now their time?
by Daniel Nenni on 03-31-2023 at 6:00 am

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Chiplets appeared on SemiWiki in 2020 and have been a top trending keyword ever since. The question is not IF chiplets will disrupt the semiconductor industry, the question is WHEN? I certainly have voiced my opinion on this (pro chiplet) but let’s hear it from the experts. There was a live panel recently sponsored by Silicon CatalystRead More