In the rapidly evolving field of artificial intelligence (AI), the demand for efficient data processing has exposed limitations in traditional memory technologies. The paper “3D Stacked IGZO 2T0C DRAM Array with Multibit Capability for Computing in Memory Applications,” published in Science Advances on May… Read More
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Advancements in 3D Stacked IGZO 2T0C DRAM for Computing-in-Memory Applications
Relaxation-Aware Programming in ReRAM: Evaluating and Optimizing Write Termination
Resistive RAM (ReRAM or RRAM) is the strongest candidate for next-generation non-volatile memory (NVM), combining fast switching speeds with low power consumption. New techniques for managing a memory phenomenon called ‘relaxation’ are making ReRAM more predictable — and easier to specify for real-world applications.… Read More
EDA AI agents will come in three waves and usher us into the next era of electronic design
Author: Niranjan Sitapure, AI Product Manager, Siemens EDA
We are at a pivotal point in Electronic Design Automation (EDA), as the semiconductors and PCB systems that underpin critical technologies, such as AI, 5G, autonomous systems, and edge computing, grow increasingly complex. The traditional EDA workflow, which includes… Read More
Safeguard power domain compatibility by finding missing level shifters
In the realm of mixed signal design for integrated circuits (ICs), level shifters play a critical role for interfacing circuits that operate at different voltage levels. A level shifter converts signal from one voltage level to another, ensuring compatibility between components. Figure 1 illustrates a missing level shifter… Read More
Metal fill extraction: Breaking the speed-accuracy tradeoff
As semiconductor technology scales and device complexity increases, accurately modeling the parasitic effects of metal fill has become critical for circuit performance, power integrity, and reliability. Metal fill is a crucial part of the manufacturing process, ensuring uniform layer density, improving planarization,… Read More
Speculative Execution: Rethinking the Approach to CPU Scheduling
By Dr. Thang Minh Tran, CEO/CTO Simplex Micro
In the world of modern computing, speculative execution has played a pivotal role in boosting performance by allowing processors to guess the outcomes of instructions ahead of time, keeping pipelines full and reducing idle cycles. Initially introduced during the development of … Read More
Keysom and Chipflow discuss the Future of RISC-V in Automotive: Progress, Challenges, and What’s Next
by, Tomi Rantakari CEO ChipFlow & Luca Testa COO Keysom
The automotive industry is undergoing a major transformation, driven by electrification, the rise of new market players, and the rapid adoption of emerging technologies such as AI. Among the most significant advancements is the growing adoption of RISC-V, an open-standard… Read More
Is AI Intelligent? Insights from Ronjon Nag’s Presentation
In his keynote at the 2024 31st IEEE Electronic Design Process Symposium, Dr. Ronjon Nag, an adjunct professor at Stanford Medicine and president of the R42 Group, poses the provocative question: “Is AI Intelligent?” Drawing from four decades of pioneering work in AI, Nag blends personal anecdotes, scientific … Read More
AI-Powered Transformation in EDA
The integration of artificial intelligence (AI) into Electronic Design Automation (EDA) is revolutionizing chip design, addressing the critical shortage of skilled engineers and accelerating the development process. As Jeff Dyck, Senior Director of Engineering at Siemens EDA, explains in a recent DACtv presentation, … Read More
Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration
In a DACtv session on July 22, 2024, Rich Goldman from Ansys discussed the partnership with NVIDIA, focusing on accelerating engineering simulations and visualizing 3D IC designs in Omniverse. The collaboration, outlined in six pillars defined by NVIDIA CEO Jensen Huang, leverages NVIDIA’s GPUs and Grace CPUs to enhance… Read More
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