Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration

Visualizing Multi-Die Design: Ansys and NVIDIA’s Omniverse Collaboration
by Admin on 08-01-2024 at 4:00 pm

In a DACtv session on July 22, 2024, Rich Goldman from Ansys discussed the partnership with NVIDIA, focusing on accelerating engineering simulations and visualizing 3D IC designs in Omniverse. The collaboration, outlined in six pillars defined by NVIDIA CEO Jensen Huang, leverages NVIDIA’s GPUs and Grace CPUs to enhance… Read More


Custom Processor Design with Verification: Insights from Codasip at DAC

Custom Processor Design with Verification: Insights from Codasip at DAC
by Admin on 08-01-2024 at 3:00 pm

At the 62nd Design Automation Conference (DAC) on July 22, 2024, Philip Bena from Codasip delivered a compelling session on processor customization, emphasizing a responsible approach that prioritizes verification. Codasip, a European company with a global presence, offers a unique combination of RISC-V processor IP and… Read More


Truechip at the 2024 Design Automation Conference

Truechip at the 2024 Design Automation Conference
by Admin on 06-17-2024 at 6:00 pm

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We are excited to announce that Truechip, a leading provider of Verification IP solutions, will be actively participating at DAC 2024, taking place from June 23-25 at Moscone West, San Francisco, CA. This event is a pivotal gathering for professionals in the verification industry, and Truechip’s presence will be a highlight … Read More


Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements

Mastering Atomic Precision – ALD’s Role in Semiconductor Advancements
by Admin on 06-11-2024 at 8:00 am

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Atomic layer deposition (ALD) is a thin-film deposition method that continues to enable continuous advances in semiconductor device fabrication. Essentially, it involves exposing substrates sequentially to at least two different vapor phase atmospheres in which self-limiting reactions take place on the surface: the first… Read More


The Case for U.S. CHIPS Act 2

The Case for U.S. CHIPS Act 2
by Admin on 06-03-2024 at 8:00 am

America CHIPs ACT

Despite murky goals and moving targets, the recent CHIPS Act sets the stage for long term government incentives.

Authored by Jo Levy and Kaden Chaung

On April 25, 2024, the U.S. Department of Commerce announced the fourth, and most likely final, grant under the current U.S. CHIPS Act for leading-edge semiconductor manufacturing.… Read More


Are you Aware about Risks Related to Soft Errors?

Are you Aware about Risks Related to Soft Errors?
by Admin on 07-10-2023 at 6:00 am

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Soft errors change stored data and cause temporal malfunctions in electronic systems. This mainly occurs when radiation particles collide with semiconductor devices. Soft errors are a concern in all environments, whether in the atmosphere, in space, or on the ground.

Soft errors are critical in high-reliability applications… Read More